Plateau HS Mezz™
High Speed Mezzanine for
10.0 Gbps Bandwidth
75003, 75005
High Speed Mezzanine Connectors Feature
Innovative Plated Plastic Housing for
Outstanding Performance
Molex utilizes its proprietary Plateau Technology™ to
create a high-speed, superior performance surface-
mounted mezzanine connector system. This technology
permits the customer to use a smaller footprint
connector than other typical designs, translating into
savings on circuit count and board space.
The shielding properties of the plated housing
effectively isolate each differential pair, eliminating the
need to use signal pins for ground.
These mezzanine connectors are ideal for servers,
mainframe computers, workstations, test equipment
and telecommunications equipment such as switches
and routers.
Features and Benefits
■
Advanced gold-plated plastic housings with
integrated shielding system support high-speed
differential signaling in excess of 10.0 Gbps
■
Impedance of 100 ± 10 ohms at 50 psec risetime
(10/90%) maintained for all stack heights to
ensure very low crosstalk between signals
■
Contacts on 1.20mm (.047”) pitch arranged in
isolated differential pairs on 3.50mm (.138”) pitch
for controlled impedance
■
Two points of contact on each signal ensure high
reliability
■
Multiple stack heights from 9.00 to 23.00mm
(.354 to .906”) to meet nearly every parallel
board requirement, with capability up to 25.00mm
(.984”)
■
Available in 6, 12, 24 and 36 differential pair sizes
(12, 24, 48 and 72 total contacts) to accommodate
a range of applications
■
Molded and plated housing pegs facilitate
attachment to PCB ground plane
SPECIFICATIONS
Reference Information
Packaging: Tape and Reel or Tube
Designed In: Millimeters
UL File No.: E29179
CSA File No.: LR19980
Electrical
Voltage: 30V DC
Current: 1.5A max.
Contact Resistance: 25 milliohms
Dielectric Withstanding Voltage: 500V
Insulation Resistance: 1,000 Megohms
Impedance: 100 +/- 10 Ohms @ 50psec risetime
Mechanical
Mating Force: 2.0N (.45lb) max. per circuit
Unmating Force: 0.9N (.20lb) min. per circuit
Durability: 25 cycles
Physical
Housing: LCP
Contact: Copper Alloy
Plating: Contact Area – 0.76µm (30µ”) min. select
Gold and 3.81µm (150µ”) min. select Tin/Lead
over 1.27µm (50µ”) min. Nickel overall
Housing – 0.10µm (4µ”) max. Gold over 3.81µm
(150µ”) min. Nickel over 3.81µm (150µ”) min.
Copper
Operating Temperature: -20 to +85°C
SMT Lead Coplanarity: 0.102mm (.004”)
MOLEX [ Molex Electronics Ltd. ]
