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71436-2364 参数 Datasheet PDF下载

71436-2364图片预览
型号: 71436-2364
PDF下载: 下载PDF文件 查看货源
内容描述: 1.00毫米( .039 “ )间距夹层IEEE 1386插件,表面贴装,双排, VerticalStacking , 64电路, 8.35毫米( 0.329 ” )未交配高度,与PCB定位器衣夹用, [1.00mm (.039") Pitch Mezzanine IEEE 1386 Plug, Surface Mount, Dual Row, VerticalStacking, 64 Circuits, 8.35mm (.329") Unmated Height, with PCB Locator Pegs, with]
分类和应用: 连接器集管和边缘连接器PC
文件页数/大小: 4 页 / 265 K
品牌: MOLEX [ Molex Electronics Ltd. ]
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Solder Process Data
Lead-free Process Capability
Process Temperature max. C
Reflow Capable (SMT only)
260
Material Info
Reference - Drawing Numbers
Product Specification
Sales Drawing
PS-71436-9999
SDA-71436-2***
This document was generated on 03/31/2010
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