FEATURES AND SPECIFICATIONS
New Micro-USB interconnect solutions set standard for sleeker mobile devices
USB Implementers Forum, Inc. (USB-IF) has finalized the specification of the Micro-USB
technology in early January 2007. The development of this new connector technology
has given the opportunity for portable device and mobile phone makers to further reduce
their real estate in their applications. The Micro-USB will replace most of the Mini-USB
plugs and receptacles that are currently being used. The specification of the Micro-USB
supports the current USB On-The-Go (OTG) supplement. This allows communication
between portable devices without going through a host. Being much smaller than the
Mini-USB, the Micro-USB is the choice of interconnect solution of mobile phone makers
such as Nokia and Motorola for their new phone designs.
Molex has developed the Micro-USB ‘B’ receptacle in standard and mid-mount version.
The design comes with a lead-in feature for blind mating. The mid-mount version
features a unique laser-welded shield design, ensuring mechanical seam strength and
rigidity of the connector body, which helps prevent damage to the plug or receptacle as
the result of any perpendicular or horizontal (wrenching) stress. Both connectors are
specified for up to 10,000 insertion cycles. To ensure maximum receptacle to PCB
retention, wide side tabs are employed. The beveled ‘B’-style mating profile design
prevents mis-mating with ‘A’-type plug.
As a member of the USB Implementer Forum, Molex’s ensure a high level of application
connectivity and reliability.
Features and Benefits
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Wider side solder tabs provide improved solder retention
Stainless steel shell (0.3mm thick) provides high mating durability & strength
Lead-in features provide blind mate
Fold-down tabs provide high housing retention
Latching windows with angular tabs prevent accidental unmating of plug
Beveled profile ‘B’ style to lock out ‘A’-type plug
Unique laser-welded shield design strengthen wrenching strength during use
Pick & place area (3mm diameter) enhances assembly process
Rear shield for EMI protection (for standard mount)
0.65mm (.025”) Pitch
Micro-USB
47346
Standard ‘B’ receptacle
47491
Mid Mount ‘B’ receptacle
SPECIIFICATIONS
Reference Information
Packaging: Embossed Tape and Reel
UL File No.:
CSA File No.:
Mates With:
Designed In: mm
Electrical
Voltage: 100V AC
Current: 1A
Contact Resistance: 40 milliohm max
Dielectric Withstanding Voltage: 100V AC
Insulation Resistance: 100 Megohms min
Mechanical
Mating Force:
35N (3.57kgf)max
Unmating Force: 10N (1.02kgf) ~ 20N(2.04kgf)
Terminal / housing retention force: 4.0N (0.41kgf)min
Durability: 10,000 cycles
Physical
Housing: Liquid Crystal Polymer, UL 94V-0
Contact: Copper Alloy
Shell: Stainless Steel (0.3mm thickness)
Plating:
Contact Area — 0.13μm Gold (Au) over 0.76μm Pd/Ni
Solder Tail Area — Gold (Au)flash
Underplating — 1.27
μm
(50 •”) Nickel (Ni) min
Coplanarity = 0.08mm max
Operating Temperature: -20°C to +85°C
MOLEX [ Molex Electronics Ltd. ]
