This document was generated on 06/08/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
Active
2.54mm (.100") Pitch C-Grid III™ Header, Dual Row, Vertical, 6 Circuits, Tin (Sn)
Plating
Documents:
Series
image - Reference only
PCB Headers
Wire-to-Board
Yes
C-Grid III™
ELV and RoHS
Compliant
Contains SVHC: No
Not Halogen-Free
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
General
Product Family
Series
Application
MolexKits
Overview
Product Name
Physical
Breakaway
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Glow-Wire Compliant
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Polarized to Mating Part
Polarized to PCB
Shrouded
Stackable
Temperature Range - Operating
Termination Interface: Style
Yes
6
6
Black
No
None
Brass
Tin
Tin
Polyester
2
Vertical
0.114 In
2.90 mm
No
None
Bag
0.100 In
2.54 mm
120
3
120
3
No
No
No
Yes
-55°C to +125°C
Through Hole
Search Parts in this Series
Electrical
Current - Maximum per Contact
Voltage - Maximum
3A
350V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
5
Wave Capable (TH only)
MOLEX [ Molex Electronics Ltd. ]
