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0901200122 参数 Datasheet PDF下载

0901200122图片预览
型号: 0901200122
PDF下载: 下载PDF文件 查看货源
内容描述: 2.54毫米( .100 )间距C-电网III ™头,单列,立式, 2回路,锡(Sn )镀层 [2.54mm (.100) Pitch C-Grid III™ Header, Single Row, Vertical, 2 Circuits, Tin (Sn) Plating]
分类和应用: 连接器集管和边缘连接器
文件页数/大小: 9 页 / 1070 K
品牌: MOLEX [ Molex Electronics Ltd. ]
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This document was generated on 06/08/2010
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
Overview:
Description:
Active
2.54mm (.100") Pitch C-Grid III™ Header, Single Row, Vertical, 2 Circuits, Tin (Sn)
Plating
Documents:
Series
General
Product Family
Series
Application
MolexKits
Overview
Product Name
PCB Headers
Wire-to-Board
Yes
C-Grid III™
image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Halogen-Free
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Physical
Breakaway
Circuits (Loaded)
Circuits (maximum)
Color - Resin
First Mate / Last Break
Glow-Wire Compliant
Guide to Mating Part
Keying to Mating Part
Lock to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Number of Rows
Orientation
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Polarized to Mating Part
Polarized to PCB
Shrouded
Stackable
Temperature Range - Operating
Termination Interface: Style
Yes
2
2
Black
No
No
No
None
None
Brass
Tin
Tin
Polyester
1
Vertical
0.114 In
2.90 mm
No
None
Bag
0.100 In
2.54 mm
160
4.00
No
No
No
No
-55°C to +125°C
Through Hole
Search Parts in this Series
Mates With
C-Grid III™ Modular Crimp Housing
Electrical
Current - Maximum per Contact
Voltage - Maximum
3A
350V
Solder Process Data
Duration at Max. Process Temperature (seconds)
10