This document was generated on 04/13/2010
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Part Number:
Status:
Description:
Active
1.00mm (.039") Pitch DDR2 DIMM Socket, Through Hole, 25° Angle, 0.76µm (30µ")
Gold (Au), 3.18mm (0.125") Soldertail, 240 Circuits, Lead free
Documents:
Series
LR19980
E29179
image - Reference only
ELV and RoHS
Compliant
Contains SVHC: No
Not Halogen-Free
Need more information on product
environmental compliance?
Email productcompliance@molex.com
For a multiple part number RoHS Certificate of
Compliance, click here
Please visit the Contact Us section for any
non-product compliance questions.
Agency Certification
CSA
UL
General
Product Family
Series
Comments
Component Type
JEDEC Outline
Product Name
Memory Module Sockets
<LI>Latches in Off-white color<LI>Lubricant at the
Contact
Socket
MO-237
DDR2 DIMM
Physical
Circuits (Loaded)
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
Keying to Mating Part
Material - Plating Mating
Material - Plating Termination
Material - Resin
PC Tail Length (in)
PC Tail Length (mm)
PCB Locator
PCB Retention
PCB Thickness Recommended (in)
PCB Thickness Recommended (mm)
Packaging Type
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µin)
Plating min: Termination (µm)
Temperature Range - Operating
Termination Interface: Style
240
Black, Natural
25
25° Angle
94V-0
Yes
Gold
Tin
High Temperature Thermoplastic
0.125 In
3.18 mm
Yes
Yes
0.093 In
2.36 mm
Tray
0.039 In
1.00 mm
30
0.76
100
2.54
-55°C to +85°C
Through Hole
Search Parts in this Series
Mates With
JEDEC standard 1.27mm modules
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
0.5A
30V AC (RMS)/DC
1.8V, Center
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
Max. Cycles at Max. Process Temperature
5
SMC & Wave Capable (TH only)
2
MOLEX [ Molex Electronics Ltd. ]
