MITSUBISHI MICROCOMPUTERS
3822 Group
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
PACKAGE OUTLINE
MMP
80P6N-A
Plastic 80pin 14ꢀ20mm body QFP
EIAJ Package Code
JEDEC Code
–
Weight(g)
1.58
Lead Material
Alloy 42
MD
QFP80-P-1420-0.80
HD
D
80
65
1
64
I
2
Recommended Mount Pad
Dimension in Millimeters
Symbol
Min
–
0
–
0.3
0.13
13.8
19.8
–
16.5
22.5
0.4
–
–
–
0°
–
1.3
–
Nom
–
Max
3.05
0.2
–
0.45
0.2
14.2
20.2
–
17.1
23.1
0.8
–
0.2
0.1
10°
–
A
A
A
1
2
0.1
2.8
0.35
0.15
14.0
20.0
0.8
16.8
22.8
0.6
1.4
–
–
–
0.5
–
14.6
20.6
b
c
D
E
e
24
41
25
40
A
HD
L1
HE
L
L1
x
y
F
e
b
L
b2
x
M
Detail F
I
2
–
–
–
y
M
M
D
E
–
MMP
80P6S-A
Plastic 80pin 14ꢀ14mm body QFP
EIAJ Package Code
QFP80-P-1414-0.65
JEDEC Code
Weight(g)
1.11
Lead Material
Alloy 42
MD
HD
D
80
61
1
60
I
2
Recommended Mount Pad
Dimension in Millimeters
Symbol
Min
–
0
–
0.25
0.13
13.8
13.8
–
16.5
16.5
0.4
–
–
–
0°
–
1.3
–
Nom
–
Max
3.05
0.2
–
0.4
0.2
14.2
14.2
–
17.1
17.1
0.8
–
0.13
0.1
10°
–
A
A
A
1
2
0.1
2.8
0.3
0.15
14.0
14.0
0.65
16.8
16.8
0.6
1.4
–
b
c
D
E
e
20
41
A
21
40
HD
L1
HE
L
L1
x
y
F
M
–
–
b
e
x
b2
0.35
–
14.6
14.6
y
L
I
2
–
–
–
Detail F
M
M
D
E
–
74
MITSUBISHI [ Mitsubishi Group ]
