SL3522
1
2
46
45
44
43
42
41
40
39
38
37 36 35 34
33
32
31
30
29
28
27
26
47
25
48
49
3
24
23
50
51
52
4
13
14
15
16
17
18
19
20
21
22
5
6
7
8
9
10
11 12
5.480mm
TO SCALE
TERMINALS ((X) DENOTES MC PACKAGE PIN NUMBER)
1
Video O/P (13)
14 VEE 5A (22)
15 VEE 4A (22)
16 GND 4B (23)
17 GND 3A (23)
18 VEE 3A (24)
19 VEE 2A (24)
20 GND 2A (25)
21 GND 1A (25)
22 VEE 1A (26)
23 Test point
27 Test point
28 VEE 1B (3)
29 GND 1B (4)
30 GND 2B (4)
31 VEE 2A (5)
32 VEE 3A (5)
33 GND 3B (6)
34 Test point
35 Test point
36 Test point
37 Test point
38 GND 4B (6)
39 VEE 4B (7)
40 VEE 5B (7)
2
3
4
5
6
7
8
9
Video O/P VCC (14)
Gain VCC (15)
Video GND (16)
Offset ADJ (17)
Trim REF (18)
Gain ADJ (19)
Gain VEE (20)
Test point
41 RF BUF O/P GND (8)
42 RF BUF O/P GND (8)
43 RF O/P – (9)
44 RF O/P + (10)
45 RF BUF O/P VEE (11)
46 Video O/P VEE (12)
47 Test point
48 Test point
10 Test point
49 Test point
11 VEE 6A (20)
12 GND 6A (21)
13 GND 5A (21)
24 RF I/P signal (27)
25 Test point
50 Test point
51 Test point
26 RF I/P return (28)
52 Test point
NOTES
1. All pads with square cross–section =120 m
2. All pads with octagonal cross–section =100 m
3. Chip is passivated with polyimide
120 m
100 m
Fig.25 SL3522 pad map for bare IC dice
17