MH89760B
Preliminary Information
C1.5i
INT DATA
OUTA
OUTB
AMI LINE
Figure 34 - DS1 Transmit Timing
Packaging
•
The MH89760B which is pin compatible with the
MH89760, has a row pitch of 1.3” and is fitted
with a plastic lid. See Figure 37 for the
dimensional drawing for this part.
The MH89760B is available in three package options
which are:
•
The MH89760BN which is a narrow version of
the MH89760B and has a row pitch of 0.8”. See
Figure 38 for the dimensional drawing for this
part.
•
The MH89760BS which is a surface mountable
version of the MH89760BN is suitable for
Infrared Reflow (I.R.) soldering. See Figure 35
for the dimensional drawing, and Figure 36 for
the recommended footprint.
0.25
(6.35)
2.0
(50.8)
0.125
(3.18)
0.78
(19.81)
0.06
(1.52)
0.06
(1.52)
0.10 + 0.01
(2.54 + 0.25)
0.9
(22.86)
0.125
(3.18)
MH89760BS
0.020 + 0.002
(0.51 + 0.051)
Note 1
Notes:
1) Pin 1 not fitted.
2) All dimensions are typical and in inches (mm).
3) Not to scale.
Figure 35 - Physical Dimensions for the 40 Pin Dual in Line S.M.T. Hybrid
4-88
MITEL [ MITEL NETWORKS CORPORATION ]
