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CMM1434-SM-0G0T 参数 Datasheet PDF下载

CMM1434-SM-0G0T图片预览
型号: CMM1434-SM-0G0T
PDF下载: 下载PDF文件 查看货源
内容描述: 13.50-14.50 GHz的2.5瓦功率放大器 [13.50-14.50 GHz 2.5-Watt Power Amplifier]
分类和应用: 放大器功率放大器
文件页数/大小: 4 页 / 155 K
品牌: MIMIX [ MIMIX BROADBAND ]
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13.50-14.50 GHz
2.5-Watt Power Amplifier
February 2007 - Rev 19-Feb-07
CMM1434-SM
Handling and Assembly Information
CAUTION!
- Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human
body and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy
- Mimix Broadband's products are not authorized for use as critical components in life support
devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As
used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions
for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical
component is any component of a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its safety or effectiveness.
ESD
- Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in anti-
static containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation.
Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment
- GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the back-
side to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The
mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Ablestick 84-1LMI or
84-1LMIT cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any
on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. If eutectic mounting is
preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001
2
thick, placed between the die and the attach-
ment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total
wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn)
has a melting point of approximately 280º C (Note: Gold Germanium should be avoided). The work station temperature
should be 310º C +/- 10º C. Exposure to these extreme temperatures should be kept to minimum. The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical
during placement.
Wire Bonding
- Windows in the surface passivation above the bond pads are provided to allow wire bonding to the
die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99%
pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge
or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding
is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized.
Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the
package or substrate. All bonds should be as short as possible.
Ordering
Information
The CMM1434-SM is available in available in tube or tape and reel.
Part Number for Ordering
Package
C M M 1431-S M
S ur f ace mount pack age
CMM1434-SM-0G0T
Matte tin plated RoHS compliant surface mount package in tape and reel
PB-CMM1434-SM
Evaluation Board
We also offer this product with SnPb (Tin-Lead) or NiPdAu plating. Please contact your regional sales manager for more
information regarding different plating types.
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 4
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.