CMM0015-BD-000V 参数 Datasheet PDF下载

2.0-22.0 GHz GaAs MMIC

Power Amplifier

April 2007 - Rev 26-Apr-07

CMM0015-BD

2.234

(0.088)

Mechanical Drawing

1.165

(0.046)

2

1.059

(0.042)

3

0.377

(0.015)

0.639

(0.025)

1

6

0.0

0.0

5

4

2.135 2.340

(0.084) (0.092)

2.024 2.244

(0.080) (0.088)

(Note: Engineering designator is M430)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.69 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd)

Bond Pad #3 (RF Out)

Bond Pad #4 (Rs-3.5 )

Bond Pad #5 (Rs-4.5 )

Bond Pad #6 (Rs-6.0 )

Bias Arrangement

Vd

Bypass Capacitors

- See App Note [2]

2

3

RF Out

RF In

1

6

5

4

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 4 of 6

Characteristic Data and Specifications are subject to change without notice.

©2007

Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.