0.8-1.0 GHz
+34 dBm Power GaAs FET
November 2007 - Rev 15-Nov-07
CFK2162-P1
Thermal Conditions
The data shown was taken on a 31 mil thick FR-4 board with 1 ounce copper on both sides. The board was mounted to a base
plate with 3 screws as shown.The screws bring the top side copper temperature to the same value as the baseplate. The
thermal resistance to the indicated reference lead,
,is 10 ºC/W. The thermal resistance to the reference screw is 12 ºC/W.
1. Use 1 or 2 ounce copper if possible.
2. Solder all eight leads of the CFK2162-P1 package to the appropriate electrical connection.
3. Solder the copper pad on the backside of the CFK2162-P1 package to the ground plane.
4. Use a lar ge ground pad area with many plated through-holes as shown.
5. If possible, use at least one screw no more than 0.2 inches from the CFK2162-P1 package to provide a low thermal
resistance path to the baseplate of the package.
Ordering Information
The CFK2162-P1 power stage is available in an SO-8 surface mount package. Devices are available in tape and reel. Ordering
part numbers are listed.
Part Number for Ordering
CFK2162-P1
CFK2162-P1-000T
Function
800 - 900 MHz Power Stage
800 - 900 MHz Power Stage
Package
SO-8 surface mount power package
SO-8 surface mount power package in tape and reel
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
MIMIX [ MIMIX BROADBAND ]
