5.5-6.5 GHz GaAs MMIC
Voltage Controlled Oscillator
May 2005 - Rev 05-May-05
6OSC0460
Mechanical Drawing
1.800
(0.071)
1.504
(0.060)
0.566
(0.022)
3
2
4
1.504
(0.060)
1.105
(0.044)
1
5
1.105
(0.044)
6
0.0
0.0
0.673
(0.027)
1.350
(0.053)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.507 mg.
Bias Arrangement
RF Out
3
e-
pr
4
5
Bond Pad #1 (Vtune)
Bond Pad #2 (Vee1)
Bond Pad #3 (RF Out)
Bond Pad #4 (Vee2)
od
Vee2
Vee3
(Note: Engineering designator is 6OSC0460)
Vee1
2
uc
Bond Pad #5 (Vee3)
Bond Pad #6 (Vee3)
Bypass Capacitors
- See App Note [2]
RF Out
Vee2
Vee3
Page 3 of 5
Vtune
Pr
1
Vee1
(Maximum 100pF)
Vtune
6
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
tio
n
MIMIX [ MIMIX BROADBAND ]
