37.0-46.0 GHz GaAs MMIC
Balanced Image Reject Mixer
November 2005 - Rev 21-Nov-05
40IRM0540
0.879
(0.035)
1.279
(0.050)
Mechanical Drawing
2.100
(0.083)
2
3
4
1.350
(0.053)
0.693
(0.027)
5
1
0.750
(0.030)
6
0.0
od
0.879
(0.035)
0.0
(Note: Engineering designator is 40IRM0540)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.592 mg.
Bond Pad #1 (RF)
Bond Pad #2 (IF1)
e-
pr
Vg1a
Bond Pad #3 (Vg1a)
Bond Pad #4 (LO)
Bias Arrangement
IF1
2
3
Bypass Capacitors
- See App Note [2]
Pr
4
LO
5
RF
Vg1b
1
6
IF2
Page 4 of 7
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
uc
1.590
(0.063)
Bond Pad #5 (Vg1b)
Bond Pad #6 (IF2)
tio
n
MIMIX [ MIMIX BROADBAND ]
