28.0-31.0 GHz GaAs MMIC
Power Amplifier
August 2005 - Rev 04-Aug-05
30MPA0562
Mechanical Drawing
0.384
(0.015)
1.380
(0.054)
0.788
(0.031)
1.188
(0.047)
1.588
(0.063)
1.988
(0.078)
2.414
(0.095)
2
3
4
5
6
7
0.657
(0.026)
1
tio
8
0.658
(0.026)
0.0
0.0
uc
(Note: Engineering designator is 30MPA0562)
2.800
(0.110)
e-
pr
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd1)
Bond Pad #4 (Vg2)
Vg2
Vd2
Vg3
5
6
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 2.396 mg.
Bond Pad #5 (Vd2)
Bond Pad #6 (Vg3)
Bond Pad #7 (Vd3)
Bond Pad #8 (RF Out)
Bias Arrangement
Vd1
Vg1
od
Vd3
8
Bypass Capacitors
- See App Note [2]
2
Pr
3
4
7
RF In
1
RF Out
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice.
©2005
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
n
MIMIX [ MIMIX BROADBAND ]
