PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
N
AS5C512K8
SRAM
MECHANICAL DEFINITIONS
N/2+1
44-Pin TSOPII (Package Designators DGC & DGCR)
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions and
should be measured from the
bottom of the package.
4. Formed leads shall be planar with
respect to one another within
0.004 inches at the seating plane.
E1
E
1
D
N/2
ZD
A
SEATING PLANE
.
e
b
A1
L
α
C
N=44 Leads
Symbol
Millimeters
(T - Type II)
Inches
Plastic TSOP
Ref. Std.
Min
Millimeters
Max
Min
Max
Millimeters
Inches
Inches
Millimeters
Inches
A
Max
‐
Min
1.20
0.047
Symbol Min Max
Min
Max
Min
‐
Max
Min Max
Min Max
A1
0.05
0.15
0.002
0.006
Ref. Std.
No. Leads (N)
32
50
b
0.30
0.45
44
0.012
0.018
A
—
1.20
—
C
0.047
0.12
—
1.20
—
0.005
0.047
0.008
—
1.20
—
0.047
0.21
A1
0.05 0.15
0.002 0.006
18.31
0.05
18.52
0.15
0.002 0.006
0.729
0.05 0.15
0.002 0.006
D
0.721
b
0.30 0.52
0.012 0.020
0.30 0.45
0.012 0.018
0.30 0.45
0.012 0.018
E1
10.03
10.29
0.395
0.405
C
0.12 0.21
0.005 0.008
0.12 0.21
0.005 0.008
0.12 0.21
0.005 0.008
E
11.56
11.96
0.455
0.471
D
20.82 21.08
0.820 0.830
18.31 18.52
0.721 0.729
20.82 21.08
0.820 0.830
e
0.400
0.80 BSC
0.032 BSC
10.03 10.29
E1
10.03 10.29
0.391
10.03 10.29
0.395 0.405
0.395 0.405
L
0.016
E
11.56 11.96
0.451 0.466
0.41
11.56
0.60
11.96
0.455 0.471
0.024
11.96
11.56
0.455 0.471
ZD
0.032 REF
0.80 BSC
0.81 REF
e
1.27 BSC
0.050 BSC
0.80 BSC
0.032 BSC
0.031 BSC
L
0.40 0.60
0.016 0.024
0
o
0.41 0.60
0.016
o
0.024
0.016 0.024
5
o
0
5
o
0.40 0.60
α
ZD
α
0.95 REF
0°
5°
0.037 REF
0°
5°
0.81 REF
0°
5°
9
0.032 REF
0°
5°
0.88 REF
0°
5°
0.035 REF
0°
5°
AS5C512K8
Rev. 7.5 01/13
Micross Components reserves the right to change products or specifications without notice.
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
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