AS8S128K32
128K x 32 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY SPECIFICATIONS
• SMD 5962-95595 (-Q); SMD 5962-93187 (-P or -PN);
MIL-STD-883
SRAM
GENERAL DESCRIPTION
8, 21, 28, 39 are no connects (PN
66 Lead PGA- Pins
The AS8S128K32 is a 4 Megabit CMOS SRAM Module or-
ganized as 128Kx32-bits and user configurable to 256Kx16 or
512Kx8. The AS8S128K32 achieves high speed access, low
power consumption and high reliability by employing advanced
CMOS memory technology.
The military temperature grade product is suited for military
applications.
The AS8S128K32 is offered in a ceramic quad flatpack module
per SMD-5962-95595 with a maximum height of 0.140 inches.
FEATURES
• Operation with single 5V supply • Built in decoupling caps for
• 2V Data Retention, Low power
low noise operation
standby
• Organized as 128K x32; User
• Vastly improved Icc Specs
configured as 256Kx16 or
• Access times of 12, 15, 17, 20,
512K x8
25, 35, and 45 ns
• TTL Compatible Inputs and
• Low power CMOS
Outputs
AS8S128K32
CE4
WE4
SRAM
OPTIONS
Timing
12ns
15ns
17ns
20ns
Markings
-12
-15
-17
-20
Timing
25ns
35ns
45ns
Markings
-25
-35
-45
128K x 8
128K x 8
128K x 8
PIN ASSIGNMENT
(Top View)
(Top View)
PIN ASSIGNMENT
(Top View)
Package
Ceramic Quad Flatpack
Pin Grid Array -8 Series
on pins 8, 21,
Markings
28, 39
Q (No. 702); Q1
P
ASSIGNMENT
PIN
(No. 802); PN* (No. 802)
AS8S128K32
*No connect
SRAM
AS8S128K32
SRAM
68 Lead CQFP
(Q & Q1)
66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)
66 Lead
PGA- Pins 8,
21, 28, 39 are
grounds (P)
66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)
66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)
Vcc
A11
A12
A13
A14
A15
A16
CS2\
OE\
CS4\
NC
NC
NC
NC
NC
NC
NC
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O
5
I/O
6
I/O
7
GND
I/O 8
I/O
9
I/O
10
I/O 11
I/O 12
I/O 13
I/O 14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
9
8
7
6
5
4
3
2
1
68
67
66
65
64
63
62
61
NC
A0
A1
A2
A3
A4
A5
CS1\
GND
CS3\
WE\
A6
A7
A8
A9
A10
Vcc
68
Lead CQFP (Q & Q1)
68
Lead CQFP (Q & Q1)
This device is also offered
in a 1.075 inch square
ceramic pin grid array per
SMD 5692-93187, which
has a maximum height of
0.195 inches. This pack-
age is also a low profile,
multi-chip module design
reducing height require-
ments to a minimum.
CE3
WE3
M2
M1
M0
128K x 8
I/O 24 - I/O 31
I/O 16 - I/O 23
I/O 8 - I/O 23
PIN
makes use of
This module
ASSIGNMENT
(Top View)
a low profile, mutlichip
module design.
CQFP (Q & Q1)
68 Lead
M3
CE2
WE2
CE1
WE1
OE
A0 - 16
I/O 0 - I/O 7
66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
I/O 23
GND
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
68 Lead
CQFP
(BQFP)
Military SMD
Pinout Option
66 Lead
PGA- Pins 8,
21, 28, 39 are
no connects
(PN)
x8
66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)
CE3
WE3
M2
128K x 8
AS8S128K32
Rev. 4.5 08/13
66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)
1
CE4
Micross
WE4
Components reserves the right to change products or specifications without notice.
M3
I/O 24 - I/O 31
MICROSS [ MICROSS COMPONENTS ]
