AS8FLC1M32
Hermetic, Multi-Chip Module
(MCM)
32Mb, 1M x 32, 3.3Volt Boot Block FLASH Array
Available via Applicable Specifications:
•
•
MIL-PRF-38534, Class H
DSCC SMD 5962-09205
I/O0
I/O1
I/02
I/O3
I/O4
I/O5
I/O6
I/O7
GND
I/O8
I/O9
I/O10
I/O11
I/012
I/O13
I/O14
I/O15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
FLASH
FIGURE 1: PIN ASSIGNMENT
(Top View)
RESET\
A0
A1
A2
A3
A4
A5
CS3\
GND
CS4\
WE1\
A6
A7
A8
A9
A10
VCC
09
08
07
06
05
04
03
02
01
68
67
66
65
64
63
62
61
60
59
78
57
76
55
54
53
52
51
50
49
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
32Mb device, total density, organized as 1M x 32
Bottom Boot Block (Sector) Architecture
Operation with single 3.3V Supply
Available in multiple Access time variations
Individual byte control via individual byte selects (CSx\)
Low Power CMOS
20 years data retention
1,000,000 Program/Erase Cycles per sector minimum
Sector Architecture:
•
One 16K byte, two 8K byte, one 32K byte and
fifteen 64Kbyte sectors
Any combination of sectors can be concurrently erased
MCM supports full array (multi-chip) Erase
Embedded Erase and Program Algorithms
Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
TTL Compatible Inputs and Outputs
Military and Industrial operating temperature ranges
[Package Designator QT]
48
47
46
45
44
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
I/O8
I/O9
I/O10
A14
A16
A11
A0
VCC
A11
A12
A13
A14
A15
A16
CS1\
OE\
CS2\
A17
WE2\
WE3\
WE4\
A18
A19
NC
Pin Assignment
(Top View)
Reset\
CS2\
GND
I/O11
A10
A9
A15
VCC
CS1\
A19
I/O3
I/O15
I/O14
I/O13
I/O12
OE\
A17
WE\
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
VCC
CS4\
NC
I/O27
A4
A5
A6
NC
CS3\
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
66 HIP
NC
A13
A8
I/O16
I/O17
I/O18
OPTION
Access Speed
70ns*
90ns
100ns
120ns
*Contact factory
Package
Ceramic Quad Flat Pack
Ceramic Hex Inline Pack
MARKING
-70
-90
-100
-120
A18
I/O0
I/O1
I/O2
[Package Designator
P
H]
GENERAL DESCRIPTION
Q
P
The AS8FLC1M32B is a 32Mb FLASH Multi
C h i p M o d u l e o rg a n i z e d a s 1 M x 3 2 b i t s . T h e
module achieves high speed access, low power consumption
and high reliability by employing advanced CMOS memory
technology. The military grade product is manufactured in
compliance to the MIL-PRF-38534 specifications, making the
AS8FLC1M32B ideally suited for military or space applica-
tions. The module is offered in a 68-lead 0.990 inch square
ceramic quad flat pack or 66-lead 1.185inch square ceramic
Hex In-line Package (HIP). The CQFP package design is tar-
geted for those applications, which require low profile SMT
Packaging.
Micross Components reserves the right to change products or specifications without notice.
Temperature Range
Full Mil (MIL-PRF-38534, Class H) /Q
Military Temp (-55
o
C to +125
o
C) /XT
Industrial (-40
o
C to +85
o
C)
/IT
For more products and information
please visit our web site at
www.micross.com
AS8FLC1M32B
Rev. 4.1 10/10
1
MICROSS [ MICROSS COMPONENTS ]
