P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
SG1842/SG1843 Series
C
U R R E N T - M O D E P W M C O N T R O L L E R
P R O D U C T I O N D A T A S H E E T
PACKAGE PIN OUTS
ABSOLUTE MAXIMUM RATINGS (Notes 1 & 2)
Supply Voltage (ICC < 3ꢁmA) ...............................................................Self Limiting
Supply Voltage (Low Impedance Source) ........................................................3ꢁV
Output Current (Peak) ....................................................................................... 1A
Output Current (Continuous) .......................................................................35ꢁmA
Output Energy (Capacitive Load)....................................................................... 5µJ
Analog Inputs (Pins 2, 3) ................................................................. -ꢁ.3V to +6.3V
Error Amp Output Sink Current .....................................................................1ꢁmA
Power Dissipation at TA = 25°C (DIL-8) ............................................................1W
Operating Junction Temperature
Hermetic (J, Y, F, L Packages)................................................................... 15ꢁ°C
Plastic (N, M, D, DM Packages) ................................................................ 15ꢁ°C
Storage Temperature Range.......................................................... -65°C to +15ꢁ°C
Lead Temperature (Soldering, 1ꢁ Seconds).................................................. 3ꢁꢁ°C
1
2
3
4
8
7
6
5
COMP
VFB
VREF
VCC
ISENSE
RT/CT
OUTPUT
GND
M & Y PACKAGE
(Top View)
1
2
3
4
8
7
6
5
COMP
VFB
VREF
VCC
ISENSE
RT/CT
OUTPUT
GND
DM PACKAGE
(Top View)
Note 1. Exceeding these ratings could cause damage to the device.
Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified
terminal.
1
2
3
4
5
6
7
14
13
12
11
10
9
COMP
N.C.
VFB
VREF
N.C.
VCC
N.C.
ISENSE
N.C.
RT/CT
VC
THERMAL DATA
OUTPUT
GND
PWR GND
M PACKAGE:
8
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
N PACKAGE:
95°C/W
65°C/W
D PACKAGE
(Top View)
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
DM PACKAGE:
COMP
1
2
3
4
5
6
7
14
13
12
11
10
9
VREF
N.C.
VFB
N.C.
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
D PACKAGE:
165°C/W
120°C/W
130°C/W
80°C/W
VCC
N.C.
ISENSE
N.C.
RT/CT
VC
OUTPUT
GROUND
POWER GND
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
Y PACKAGE:
8
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
J PACKAGE:
J & N PACKAGE
(Top View)
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
F PACKAGE:
1. COMP
2. VFB
10.VREF
1
2
3
4
5
10
9
8
7
6
9. VCC
3. ISENSE
8. VC
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
L PACKAGE:
80°C/W
4. RT/CT
7. OUTPUT
6. GND
5. POWER GND
145°C/W
F PACKAGE
(Top View)
THERMAL RESISTANCE-JUNCTION TO CASE, θJC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
120°C/W
3
2
1 20 19
1. N.C.
11. N.C.
12. GROUND
13. N.C.
14. N.C.
15. OUTPUT
16. N.C.
17. VCC
Junction Temperature Calculation: TJ = TA + (PD x θJA).
2. COMP
3. N.C.
4. N.C.
5. VFB
The θJA numbers are guidelines for the thermal performance of the device/pc-board
4
18
system. All of the above assume no ambient airflow.
5
6
7
8
17
16
15
14
6. N.C.
7. ISENSE
8. N.C.
9. N.C.
10. RT/CT
18. N.C.
19. N.C.
20. VREF
9
10 11 12 13
L PACKAGE
(Top View)
Copyright © 2000
Rev. 1.6 4/00
2
MICROSEMI [ Microsemi ]
