PRODUCT DATABOOK 1996/1997
MC33164-3/MC34164-3
3 V U
N D E RV O LTA G E
S
E N S I N G
C
I R C U I T
P
R O D U C T I O N
D
A T A
S
H E E T
ABSOLUTE MAXIMUM RATINGS
(Note 1)
PACKAGE PIN OUTS
RESET
V
IN
N.C.
GROUND
1
2
3
4
8
7
6
5
N.C.
N.C.
N.C.
N.C.
Input Supply Voltage (V
IN
) ............................................................................... -1V to 12V
RESET Output Voltage (V
OUT
) ..................................................................................... 12V
Output Sink Current (I
OL
) ............................................................ Internally Limited (mA)
Clamp Diode Forward Current (I
F
), Pin 1 to pin 2 ............................................... 100mA
Operating Junction Temperature
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
DM PACKAGE
(Top View)
3.
GROUND
THERMAL DATA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
156°C/W
165°C/W
2.
V
IN
1.
RESET
LP PACKAGE
(Top View)
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
BLOCK DIAGRAM
V
IN
RESET
1.2 V
REF
GROUND
2
Copyright © 1999
Rev. 1.2 6/99
MICROSEMI [ MICROSEMI CORPORATION ]
