LX1691
Enhanced Multi-Mode CCFL Controller
®
TM
PRODUCTION DATA SHEET
MECHANICAL DRAWING
16-Pin Thin Small Shrink Outline (TSSOP)
PW
P
E
1 2 3
F
D
A
H
SEATING PLANE
L
B
C
G
M
MILLIMETERS
INCHES
Dim
MIN
0.85
0.19
0.09
4.90
4.30
MAX
0.95
0.30
0.20
5.10
4.50
MIN
0.033
0.007
MAX
0.037
0.012
A
B
C
D
E
0.0035 0.008
0.192
0.169
0.200
0.177
F
0.65 BSC
0.025 BSC
G
H
L
M
P
*LC
0.05
–
0.50
0°
6.25
–
0.15
1.10
0.75
8°
6.50
0.10
0.002
–
0.020
0°
0.246
–
0.005
.0433
0.030
8°
0.256
0.004
Note:
1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not
include solder coverage.
Copyright © 2003
Rev. 1.0, 7/16/2004
Microsemi
Integrated Products
Page 14
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
MICROSEMI [ Microsemi ]
