PRODUCT DATABOOK 1996/1997
LX1664/64A, LX1665/65A
D
UAL
O
UTPUT
PWM C
ONTROLLERS
P
R O D U C T I O N
WITH
5-B
IT
DAC
D
A T A
S
H E E T
PACKAGE PIN OUTS
SS
INV
V
CC_CORE
VID0
VID1
VID2
VID3
VID4
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
D E S C R I P T I O N
(con't.)
Smallest Package Size.
The LX1664 is
available in a narrow body 16-pin surface
mount IC package for space sensitive appli-
cations. The LX1665 provides the additional
functions of Over Voltage Protection (OVP)
and Power Good (PWRGD) output drives
for applications requiring output voltage
monitoring and protection functions.
Ultra-Fast Transient Response re-
duces system cost.
The modulated off-
time architecture results in the fastest tran-
sient response for a given inductor, reduc-
ing output capacitor requirements, and re-
ducing the total regulator system cost.
Over-Voltage Protection and Power
Good Flag.
The OVP output in the LX1665
& LX1665A can be used to drive an SCR
crowbar circuit to protect the load in the
event of a short-circuit of the main MOSFET.
The LX1665 & LX1665A also have a logic-
level Power Good Flag to signal when the
output voltage is out of specified limits.
V
C1
TDRV
GND
BDRV
V
CC
C
T
L
DRV
L
FB
N PACKAGE — 16-Pin
LX1664/1664A
(Top View)
SS
INV
V
CC_CORE
VID0
VID1
VID2
VID3
VID4
L
FB
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
DEVICE SELECTION GUIDE
DEVICE
LX1664
LX1664A
LX1665
LX1665A
Packages
16-pin SOIC
& DIP
18-pin SOIC
& DIP
OVP and
Power Good
No
Yes
Current-Sense
Comp. Thresh. (mV)
100
60
100
60
Optimal Load
Pentium-class (<10A)
Pentium II (> 10A)
Pentium-class (<10A)
Pentium II (> 10A)
V
C1
TDRV
GND
BDRV
V
CC
C
T
OV
L
DRV
PWRGD
N PACKAGE — 18-Pin
LX1665/1665A
(Top View)
A B S O L U T E M A X I M U M R AT I N G S
(Note 1)
Supply Voltage (V
C1
) .................................................................................................... 25V
Supply Voltage (V
CC
) .................................................................................................... 15V
Output Drive Peak Current Source (500ns) ............................................................... 1.5A
Output Drive Peak Current Sink (500ns) ................................................................... 1.5A
Input Voltage (SS, INV, V
CC_CORE
, C
T
, VID0-VID4) ........................................... -0.3V to 6V
Operating Junction Temperature
Plastic (N, D & DW Packages) ............................................................................. 150°C
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
SS
INV
V
CC_CORE
VID0
VID1
VID2
VID3
VID4
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
C1
TDRV
GND
BDRV
V
CC
C
T
L
DRV
L
FB
D PACKAGE — 16-Pin
LX1664/1664A
(Top View)
SS
INV
V
CC_CORE
VID0
VID1
VID2
VID3
VID4
L
FB
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
T H E R M A L D ATA
N (16-PIN DIP) PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
N (18-PIN DIP) PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
D PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DW PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
90°C/W
120°C/W
60°C/W
65°C/W
V
C1
TDRV
GND
BDRV
V
CC
C
T
OV
L
DRV
PWRGD
DW PACKAGE — 18-Pin
LX1665/1665A
(Top View)
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
2
Copyright © 1999
Rev. 1.2 11/99
MICROSEMI [ MICROSEMI CORPORATION ]
