PRODUCT DATABOOK 1996/1997
LX1562/1563
S
E C O N D
-G
E N E R AT I O N
P
O W E R
F
A C T O R
C
O N T R O L L E R
P
R O D U C T I O N
D
A T A
S
H E E T
A B S O L U T E M A X I M U M R AT I N G S
(Note 1)
PACKAGE PIN OUTS
E.A. INV.
E.A. OUT
MULT. INPUT
C.S.
1
2
3
4
8
7
6
5
Supply Voltage (V
IN
) ...................................................................................... -0.3V to 28V
Peak Driver Output Current (Note 3) ................................................................. ±500mA
Driver Output Clamping Diodes
V
O
> V
CC
or V
O
< -0.3V ........................................................................................ ±10mA
Detector Clamping Diodes
V
DET
> 6V or V
DET
< 0.9V ..................................................................................... ±10mA
Error Amp, Multiplier, and Comparator Input Voltages ................................ -0.3V to 6V
Detector Input Voltage (Note 2) ....................................................................... -0.3 to 6V
Operating Junction Temperature
Plastic (M and DM Packages) ............................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
Note 2. With no limiting resistor.
Note 3. Current duty cycle is chosen such that T
J
is below 150°C.
V
IN
OUT
GROUND
I
DET
M PACKAGE
(Top View)
E.A. INV.
E.A. OUT
MULT. INPUT
C.S.
1
2
3
4
8
7
6
5
V
IN
OUT
GROUND
I
DET
DM PACKAGE
(Top View)
T H E R M A L D ATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θ
JA
165°C/W
95°C/W
Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
The
θ
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
2
Copyright © 1996
Rev. 1.3 12/96
MICROSEMI [ MICROSEMI CORPORATION ]
