LX1734
TM
®
1.0MHz Inverting DC/DC Converter
PACKAGE DIMENSIONS
LM
6-Pin Plastic Exposed Pad JEDEC MO-229 Reference
D
WWW .
Microsemi
.C
OM
Dim
A
A1
A2
A3
b
D
E
e
D2
E2
L
L2
K
E
TOP VIEW
θ
A2
A
.08
A3
b
SIDE VIEW
e
L2
A1
θ
Note:
M
ILLIMETERS
MIN
MAX
0.80
1.05
*
0.05
0.65
0.75
0.15
0.25
0.33
0.45
2.90
3.10
2.90
3.10
0.95 BSC
1.78
2.34
1.01
1.57
0.20
0.45
---
0.13
0.20
*
0°
12°
I
NCHES
MIN
MAX
0.031 0.041
0.002
0.025 0.295
0.006 0.010
0.012 0.017
0.114 0.122
0.114 0.122
0.037 BSC
0.070 0.092
0.039 0.061
0.007 0.017
---
0.005
0.007
*
0°
12°
D2
E2
1. Dimensions do not include mold flash or protrusions;
these shall not exceed 0.155mm(.006”) on any side.
Lead dimension shall not include solder coverage.
L
BOTTOM VIEW
M
ECHANICAL
M
ECHANICAL
Copyright
©
2002
Rev. 3.0a, 2005-03-14
Microsemi
Microsemi Integrated Products
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 7
MICROSEMI [ MICROSEMI CORPORATION ]
