VSP 94x2A
DATA SHEET
4.6. Electrical Characteristics
Abbreviations
tbd = to be defined
vacant= not applicable
positive current values means current flowing into the chip
4.6.1. Absolute Maximum Ratings
Stresses beyond those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only. Functional operations of the device at these conditions in not implied Exposure to absolute
maximum rating conditions for extended periods will affect device reliability.
This device contains circuitry to protect the inputs and outputs against damage due to high static voltages or electric
fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than abso-
lute maximum-rated voltages to this high-impedance circuit.
All voltages listed are referenced to ground except where noted.
All GND pins must be connected to a low-resistive ground plane close to the IC.
Table 4–1: Absolute Maximum Ratings
Symbol
Parameter
Pin Name
Limit Values
Max
Unit
Min
1)
T
Ambient Temperature
PMQFP80-1
A
2)
−10
70
°C
T
Case Temperature
PMQFP80-1
C
S
−10
−65
105
125
°C
°C
T
Storage Temperature
3)
P
Maximum Power Dissipation
PMQFP80-1
MAX
DD1
1500
mW
V
4) 5)
V
Supply Voltages1
Supply Voltages2
VDDDx,
-0.3
-0.3
2
VDDAFBL
VDDARGB
VDDAC1
VDDAC2
VDDAPLL
4) 5)
L
VDDPx,
3.6
V
V
DD2
VDD33C,
VDD33RGB,
VDDACU,
VDDACV
∆V
Internally Conected Power Supplies Groups of inter-
SUP
have to be connected externally
with an impedance of less than
0.05 Ω
nally conected
power supply
pins:
{VSSDx,
VSSPx},
{VDDDx},
{VDDPx},
{VDDACU/V}
114
Aug. 16, 2004; 6251-552-1DS
Micronas