DATA SHEET
HAL82x
1.6. Solderability and Welding
Solderability
During soldering reflow processing and manual
reworking, a component body temperature of 260 °C
should not be exceeded.
– overvoltage and reverse-voltage protection at all
pins
– magnetic characteristics extremely robust against
mechanical stress
– short-circuit protected push-pull output
– EMC and ESD optimized design
1.3. Marking Code
The HAL82x has a marking on the package surface
(branded side). This marking includes the name of the
sensor and the temperature range.
Type
A
HAL824
HAL825
824A
825A
Temperature Range
K
824K
825K
Welding
Device terminals should be compatible with laser and
resistance welding. Please note that the success of
the welding process is subject to different welding
parameters which will vary according to the welding
technique used. A very close control of the welding
parameters is absolutely necessary in order to reach
satisfying results. Micronas, therefore, does not give
any implied or express warranty as to the ability to
weld the component.
1.7. Pin Connections and Short Descriptions
Pin
No.
1
2
3
Pin Name
V
DD
GND
OUT
OUT
Type
IN
Short Description
Supply Voltage and
Programming Pin
Ground
Push Pull Output
and Selection Pin
1.4. Operating Junction Temperature Range (T
J
)
The Hall sensors from Micronas are specified to the
chip temperature (junction temperature T
J
).
A:
TJ =
−40
°C to +170 °C
K:
TJ =
−40
°C to +140 °C
The relationship between ambient temperature (T
A
)
and junction temperature is explained in Section 4.4.
1
V
DD
1.5. Hall Sensor Package Codes
HALXXXPA-T
Temperature Range: A and K
Package: UT for TO92UT-1/-2
Type: 824 or 825
2
GND
3
OUT
Example:
HAL825UT-K
→
Type:
825
→
Package:
TO92UT
→
Temperature Range: T
J
=
−40
°C to +140 °C
Hall sensors are available in a wide variety of packag-
ing versions and quantities. For more detailed informa-
tion, please refer to the brochure: “Hall Sensors:
Ordering Codes, Packaging, Handling”.
Fig. 1–1:
Pin configuration
Micronas
Feb. 3, 2009; DSH000143_003EN
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