DATA SHEET
HAL401
1.5. Solderability and Welding
Soldering
During soldering reflow processing and manual rework-
ing, a component body temperature of 260
°C
should not
be exceeded.
Welding
Device terminals should be compatible with laser and re-
sistance welding. Please note that the success of the
welding process is subject to different welding parame-
ters which will vary according to the welding technique
used. A very close control of the welding parameters is
absolutely necessary in order to reach satisfying results.
Micronas, therefore, does not give any implied or ex-
press warranty as to the ability to weld the component.
1 V
DD
2
3
4
GND
OUT1
OUT2
Fig. 1–1:
Pin configuration
Micronas
5
MICRONAS [ MICRONAS ]
