HAL300
DATA SHEET
3.6. Characteristics at T = –40 °C to +170 °C , V = 4.5 V to 24 V, GND = 0 V
J
DD
at Recommended Operation Conditions if not otherwise specified in the column “Conditions”.
Typical Characteristics for T = 25 °C and V = 12 V
J
DD
Symbol
Parameter
Pin No.
Limit Values
Typ.
Unit
Conditions
Min.
4.0
Max.
6.8
I
I
Supply Current
1
1
5.5
5
mA
mA
T = 25 °C
J
DD
Supply Current over
Temperature Range
2.5
7.5
DD
V
V
V
Overvoltage Protection
at Supply
1
3
3
3
–
3
–
–
–
–
–
–
28.5
28
32.5
32.5
400
10
V
I
= 25 mA, T = 25 °C,
DDZ
DD J
t = 20 ms
I = 25 mA, T = 25 °C,
OL
OvervoltageProtectionatOutput
V
OZ
J
t = 20 ms
Output Voltage over
Temperature Range
180
0.06
62
mV
μA
kHz
μs
I
O
= 20 mA
OL
I
f
t
Output Leakage Current over
Temperature Range
V
= 4.5 V...24 V,
OH
OH
DB < DB
, T ≤ 150 °C
J
OFF
Internal Oscillator
Chopper Frequency
–
osc
Enable Time of Output
35
–
V
= 12 V,
en(O)
DD
after Setting of V
DB > DB + 2mT or
DD
ON
DB < DB
– 2mT
OFF
t
t
Output Rise Time
Output Fall Time
3
3
–
–
–
80
400
400
200
ns
V
= 12 V, RL = 820 Ω,
r
DD
CL = 20 pF
V = 12 V, RL = 820 Ω,
DD
45
ns
f
CL = 20 pF
R
case
SOT89B-2
Thermal Resistance Junction to
Substrate Backside
150
K/W
Fiberglass Substrate
30 mm x 10 mm x 1.5 mm,
pad size see Fig. 3–6
thJSB
R
Thermal Resistance
–
150
200
K/W
thJS
case
Junction to Soldering Point
TO92UA-3,
TO92UA-4
1.80
1.05
1.45
2.90
1.05
0.50
1.50
Fig. 3–6:
Recommended footprint SOT89B, Dimensions in mm
All dimensions are for reference only. The pad size may vary depending on the requirements of the soldering process.
14
Micronas
MICRONAS [ MICRONAS ]
