HAL11x
1.4. Operating Junction Temperature Range
2. Functional Description
The Hall sensors from Micronas are specified to the chip
The HAL11x sensors are monolithic integrated circuits
which switch in response to magnetic fields. If a
magnetic field with flux lines perpendicular to the
sensitive area is applied to the sensor, the biased Hall
plate forces a Hall voltage proportional to this field. The
Hall voltage is compared with the actual threshold level
in the comparator. The temperature-dependent bias
increases the supply voltage of the Hall plates and
adjusts the switching points to the decreasing induction
of magnets at higher temperatures. If the magnetic field
exceeds the threshold levels, the open drain output
switches to the appropriate state. The built-in hysteresis
eliminatesoscillationandprovidesswitchingbehaviorof
output without bouncing.
temperature (junction temperature T ).
J
K: T = –40 °C to +140 °C
J
E: T = –40 °C to +100 °C
J
C: T = 0 °C to +100 °C
J
The relationship between ambient temperature (T ) and
A
junction temperatureisexplainedinsection5.2. onpage
14.
1.5. Hall Sensor Package Codes
HALXXXPA-T
Shunt protection devices clamp voltage peaks at the
Temperature Range: K, E, or C
Output-pin and V -pin together with external series
DD
Package: SF for SOT-89B
UA for TO-92UA
resistors. Reverse current is limited at the V -pin by an
internal series resistor up to –15 V. No external reverse
DD
(SO for SOT-89A)
protection diode is needed at the V -pin for reverse
DD
Type: 11x
voltages ranging from 0 V to –15 V.
Example: HAL114UA-E
HAL11x
Reverse
V
DD
1
→ Type: 114
→ Package: TO-92UA
Temperature
Dependent
Bias
Short Circuit &
Overvoltage
Protection
Hysteresis
Control
Voltage &
Overvoltage
Protection
→ Temperature Range: T = –40 °C to +100 °C
J
Hall Plate
Comparator
OUT
3
Hall sensors are available in a wide variety of packaging
versions and quantities. For more detailed information,
please refer to the brochure: “Ordering Codes for Hall
Sensors”.
Output
GND
2
1.6. Solderability
Fig. 2–1: HAL11x block diagram
all packages: according to IEC68-2-58
During soldering reflow processing and manual
reworking, a component body temperature of 260 °C
should not be exceeded.
Components stored in the original packaging should
provideashelflifeofatleast12months, startingfromthe
date code printed on the labels, even in environments as
extreme as 40 °C and 90% relative humidity.
V
DD
1
OUT
3
2
GND
Fig. 1–1: Pin configuration
4
Micronas
MICRONAS [ MICRONAS ]
