HAL114
Electrical Characteristics,
continued
Symbol
I
OH
I
DD
I
DD
t
en(O)
t
r
t
f
R
thJSB
case
SOT-89A
R
thJA
case
TO-92UA
Parameter
Output Leakage Current over
Temperature Range
Supply Current
Supply Current over
Temperature Range
Enable Time of Output
after Setting of V
DD
Output Rise Time
Pin No.
3
Min.
–
Typ.
–
Max.
10
Unit
µA
Test Conditions
B < B
off
V
OH
= 24 V, T
J
< 150
°C
T
J
= 25
°C
1
1
6
3.9
8.2
8.2
11
12
mA
mA
µs
3
–
6
10
V
DD
= 12 V
V
DD
= 12 V, RL = 820 Ohm,
CL = 20 pF
V
DD
= 12 V, RL = 820 Ohm,
CL = 20 pF
Fiberglass Substrate
pad size see Fig. 6
3
–
85
400
ns
Output Fall Time
3
–
60
400
ns
Thermal Resistance Junction to
Substrate Backside
–
150
200
K/W
Thermal Resistance
Junction to Soldering Point
–
150
200
K/W
Leads at ambient tempera-
ture at a distance of 2 mm
from case
Magnetic Characteristics
at T
J
= –40
°C
to +170
°C,
V
DD
= 4.5 V to 24 V,
Typical Characteristics for V
DD
= 12 V
Magnetic flux density values of switching points.
Positive flux density values refer to the magnetic south pole at the branded side of the package.
Parameter
Min.
On point B
ON
Off point B
OFF
Hysteresis B
HYS
7.5
4.3
2.8
–40
°C
Typ.
21.5
17.4
4.1
Max.
36.0
33.2
5.0
Min.
7.0
4.0
2.8
25
°C
Typ.
21.3
17.6
3.7
Max.
34.0
31.2
4.5
Min.
6.3
3.6
2.6
100
°C
Typ.
19.6
16.1
3.5
Max.
31.5
28.9
4.0
Min.
6.0
3.6
2.2
170
°C
Typ.
19.2
15.8
3.4
Max.
31.0
28.8
4.0
mT
mT
mT
Unit
Output Voltage
5.0
2.0
0 B
OFF min
B
OFF
B
HYS
B
ON
B
ON max
1.0
2.0
Fig. 5:
Definition of switching points and hysteresis
Fig. 6:
Recommended pad size SOT-89A
Dimensions in mm
MICRONAS INTERMETALL
5