DATA SHEET
HAL1xy
2.5. Characteristics
at TJ = −20 °C to +125 °C, VDD = 3.8 V to 24 V, GND = 0 V
at Recommended Operation Conditions if not otherwise specified in the column “Conditions”.
Typical Characteristics for TJ = 25 °C and VDD = 12 V.
Symbol
Parameter
Pin No.
Min.
Typ.
Max.
Unit
Conditions
I
Supply Current over
Temperature Range
1
1.6
3
5.2
mA
DD
V
V
V
Overvoltage Protection
at Supply
1
3
3
3
−
−
−
−
−
28.5
28
32
V
I
= 25 mA, T = 25 °C,
DD J
DDZ
t = 20 ms
I = 25 mA, T = 25 °C,
OH
t = 20 ms
I = 20 mA
OL
Overvoltage Protection at Output
32
V
OZ
J
Output Voltage over
Temperature Range
130
−
400
10
mV
µA
OL
I
f
Output Leakage Current over
Temperature Range
Output switched off,
T ≤150 °C, V = 3.8 to 24 V
OH
J
OH
Internal Oscillator Chopper
Frequency over Temperature
Range
−
−
−
62
−
−
−
kHz
kHz
µs
HAL10y, HAL11y
HAL104
osc
140
35
t
Enable Time of Output after
1
en(O)
Setting of V
DD
t
t
Output Rise Time
Output Fall Time
3
3
−
−
75
50
400
400
ns
ns
V
= 12 V,
DD
r
R = 820 Ohm,
C = 20 pF
L
L
f
SOT89B Package
Thermal Resistance
Measured with a 1s0p board
30 mm x 10 mm x 1.5 mm,
pad size (see Fig. 2–3)
R
R
Junction to Ambient
Junction to Case
−
−
−
−
−
−
212
73
K/W
K/W
thja
thjc
TO92UA Package
Thermal Resistance
Measured with a 1s0p board
R
R
Junction to Ambient
Junction to Case
−
−
−
−
−
−
225
63
K/W
K/W
thja
thjc
1)
V
= 12 V, B > B + 2 mT or B < B
− 2 mT
OFF
DD
ON
1.80
1.05
1.45
2.90
1.05
0.50
1.50
Fig. 2–3: Recommended footprint SOT89B-3, Dimensions in mm
All dimensions are for reference only. The pad size may vary depending on the requirements of the soldering process.
Micronas
April 8, 2009; DSH000150_001EN
9
MICRONAS [ MICRONAS ]
