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MT48LC2M32B2TG 参数 Datasheet PDF下载

MT48LC2M32B2TG图片预览
型号: MT48LC2M32B2TG
PDF下载: 下载PDF文件 查看货源
内容描述: 同步DRAM [SYNCHRONOUS DRAM]
分类和应用: 动态存储器
文件页数/大小: 53 页 / 1810 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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64Mb: x32  
SDRAM  
Data from any READ burst may be truncated with a  
subsequent WRITE command, and data from a fixed-  
length READ burst may be immediately followed by  
data from a WRITE command (subject to bus turn-  
around limitations). The WRITE burst may be initiated  
on the clock edge immediately following the last (or last  
desired) data element from the READ burst, provided  
that I/O contention can be avoided. In a given system  
design, there may be a possibility that the device driv-  
ing the input data will go Low-Z before the SDRAM DQs  
go High-Z. In this case, at least a single-cycle delay  
should occur between the last read data and the WRITE  
command.  
The DQM input is used to avoid I/O contention, as  
shown in Figures 9 and 10. The DQM signal must be  
asserted (HIGH) at least two clocks prior to the WRITE  
command (DQM latency is two clocks for output buff-  
ers) to suppress data-out from the READ. Once the  
WRITE command is registered, the DQs will go High-Z  
(or remain High-Z), regardless of the state of the DQM  
signal; provided the DQM was active on the clock just  
prior to the WRITE command that truncated the READ  
command. If not, the second WRITE will be an invalid  
WRITE. For example, if DQM was low during T4 in Fig-  
ure 10, then the WRITEs at T5 and T7 would be valid,  
while the WRITE at T6 would be invalid.  
The DQM signal must be de-asserted prior to the  
WRITE command (DQM latency is zero clocks for input  
buffers) to ensure that the written data is not masked.  
Figure 9 shows the case where the clock frequency al-  
lows for bus contention to be avoided without adding a  
NOP cycle, and Figure 10 shows the case where the  
additional NOP is needed.  
Figure 9  
READ to WRITE  
T0  
T1  
T2  
T3  
T4  
CLK  
DQM  
READ  
NOP  
NOP  
NOP  
WRITE  
COMMAND  
ADDRESS  
Figure 10  
READ to WRITE with  
Extra Clock Cycle  
BANK,  
COL n  
BANK,  
COL b  
t
CK  
t
HZ  
T0  
T1  
T2  
T3  
T4  
T5  
DOUT n  
DIN b  
CLK  
DQ  
t
DS  
DON’T CARE  
DQM  
READ  
NOP  
NOP  
NOP  
NOP  
WRITE  
COMMAND  
ADDRESS  
NOTE:  
A CAS latency of three is used for illustration. The READ  
command may be to any bank, and the WRITE command  
BANK,  
BANK,  
COL n  
COL b  
t
HZ  
DOUT  
n
DIN  
b
DQ  
t
DS  
DON’T CARE  
NOTE:  
A CAS latency of three is used for illustration. The READ command  
may be to any bank, and the WRITE command may be to any bank.  
64Mb: x32 SDRAM  
64MSDRAMx32_5.p65 – Rev. B; Pub. 6/02  
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.  
©2002,MicronTechnology,Inc.  
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