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MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1Gb: x4, x8, x16 DDR3 SDRAM  
Electrical Characteristics and AC Operating Conditions  
20. The setup and hold times are listed converting the base specification values (to which  
derating tables apply) to VREF when the slew rate is 1 V/ns. These values, with a slew rate  
of 1 V/ns, are for reference only.  
21. When the device is operated with input clock jitter, this parameter needs to be derated  
by the actual tJITper (larger of tJITper (MIN) or tJITper (MAX) of the input clock (output  
deratings are relative to the SDRAM input clock).  
22. Single-ended signal parameter.  
23. The DRAM output timing is aligned to the nominal or average clock. Most output pa-  
rameters must be derated by the actual jitter error when input clock jitter is present,  
even when within specification. This results in each parameter becoming larger. The fol-  
lowing parameters are required to be derated by subtracting tERR10per (MAX): tDQSCK  
(MIN), tLZDQS (MIN), tLZDQ (MIN), and tAON (MIN). The following parameters are re-  
quired to be derated by subtracting tERR10per (MIN): tDQSCK (MAX), tHZ (MAX), tLZDQS  
(MAX), tLZDQ MAX, and tAON (MAX). The parameter tRPRE (MIN) is derated by subtract-  
ing tJITper (MAX), while tRPRE (MAX) is derated by subtracting tJITper (MIN).  
24. The maximum preamble is bound by tLZDQS (MAX).  
25. These parameters are measured from a data strobe signal (DQS, DQS#) crossing to its re-  
spective clock signal (CK, CK#) crossing. The specification values are not affected by the  
amount of clock jitter applied, as these are relative to the clock signal crossing. These  
parameters should be met whether clock jitter is present.  
26. The tDQSCK (DLL_DIS) parameter begins CL + AL - 1 cycles after the READ command.  
27. The maximum postamble is bound by tHZDQS (MAX).  
28. Commands requiring a locked DLL are: READ (and RDAP) and synchronous ODT com-  
mands. In addition, after any change of latency tXPDLL, timing must be met.  
29. tIS (base) and tIH (base) values are for a single-ended 1 V/ns control/command/address  
slew rate and 2 V/ns CK, CK# differential slew rate.  
30. These parameters are measured from a command/address signal transition edge to its  
respective clock (CK, CK#) signal crossing. The specification values are not affected by  
the amount of clock jitter applied as the setup and hold times are relative to the clock  
signal crossing that latches the command/address. These parameters should be met  
whether clock jitter is present.  
31. For these parameters, the DDR3 SDRAM device supports tnPARAM (nCK) = RU(tPARAM  
[ns]/tCK[AVG] [ns]), assuming all input clock jitter specifications are satisfied. For exam-  
ple, the device will support tnRP (nCK) = RU(tRP/tCK[AVG]) if all input clock jitter specifi-  
cations are met. This means that for DDR3-800 6-6-6, of which tRP = 5ns, the device will  
support tnRP = RU(tRP/tCK[AVG]) = 6 as long as the input clock jitter specifications are  
met. That is, the PRECHARGE command at T0 and the ACTIVATE command at T0 + 6 are  
valid even if six clocks are less than 15ns due to input clock jitter.  
32. During READs and WRITEs with auto precharge, the DDR3 SDRAM will hold off the in-  
ternal PRECHARGE command until tRAS (MIN) has been satisfied.  
33. When operating in DLL disable mode, the greater of 4CK or 15ns is satisfied for tWR.  
34. The start of the write recovery time is defined as follows:  
• For BL8 (fixed by MRS or OTF): Rising clock edge four clock cycles after WL  
• For BC4 (OTF): Rising clock edge four clock cycles after WL  
• For BC4 (fixed by MRS): Rising clock edge two clock cycles after WL  
35. RESET# should be LOW as soon as power starts to ramp to ensure the outputs are in  
High-Z. Until RESET# is LOW, the outputs are at risk of driving and could result in exces-  
sive current, depending on bus activity.  
36. The refresh period is 64ms when TC is less than or equal to 85°C. This equates to an aver-  
age refresh rate of 7.8125μs. However, nine REFRESH commands should be asserted at  
least once every 70.3μs. When TC is greater than 85°C, the refresh period is 32ms.  
37. Although CKE is allowed to be registered LOW after a REFRESH command when  
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
87  
‹ 2006 Micron Technology, Inc. All rights reserved.  
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