欢迎访问ic37.com |
会员登录 免费注册
发布采购

MT41J256M4 参数 Datasheet PDF下载

MT41J256M4图片预览
型号: MT41J256M4
PDF下载: 下载PDF文件 查看货源
内容描述: DDR3 SDRAM MT41J256M4 â ????梅格32 ×4× 8银行MT41J128M8 â ????梅格16 ×8× 8银行MT41J64M16 â ???? 8梅格×16× 8银行 [DDR3 SDRAM MT41J256M4 – 32 Meg x 4 x 8 banks MT41J128M8 – 16 Meg x 8 x 8 banks MT41J64M16 – 8 Meg x 16 x 8 banks]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 214 页 / 2938 K
品牌: MICRON [ MICRON TECHNOLOGY ]
 浏览型号MT41J256M4的Datasheet PDF文件第206页浏览型号MT41J256M4的Datasheet PDF文件第207页浏览型号MT41J256M4的Datasheet PDF文件第208页浏览型号MT41J256M4的Datasheet PDF文件第209页浏览型号MT41J256M4的Datasheet PDF文件第211页浏览型号MT41J256M4的Datasheet PDF文件第212页浏览型号MT41J256M4的Datasheet PDF文件第213页浏览型号MT41J256M4的Datasheet PDF文件第214页  
1Gb: x4, x8, x16 DDR3 SDRAM  
Asynchronous to Synchronous ODT Mode Transition (Power-  
Down Exit)  
Asynchronous to Synchronous ODT Mode Transition (Power-Down Exit)  
The DRAM’s ODT can exhibit either asynchronous or synchronous behavior during  
power-down exit (PDX). This transition period occurs if the DLL is selected to be off  
when in precharge power-down mode by setting MR±[12] to ±. Power-down exit begins  
tANPD prior to CKE first being registered HIGH, and ends tXPDLL after CKE is first reg-  
istered HIGH. tANPD is equal to the greater of ODTLoff + 1tCK or ODTLon + 1tCK. The  
transition period is tANPD + tXPDLL.  
ODT assertion during power-down exit results in an RTT change as early as the lesser of  
tAONPD (MIN) and ODTLon × tCK + tAON (MIN), or as late as the greater of tAONPD  
(MAX) and ODTLon × tCK + tAON (MAX). ODT de-assertion during power-down exit  
may result in an RTT change as early as the lesser of tAOFPD (MIN) and ODTLoff × tCK +  
tAOF (MIN), or as late as the greater of tAOFPD (MAX) and ODTLoff × tCK + tAOF (MAX).  
Table 92 (page 2±9) summarizes these parameters.  
If AL has a large value, the uncertainty of the RTT state becomes quite large. This is be-  
cause ODTLon and ODTLoff are derived from WL, and WL is equal to CWL + AL. Fig-  
ure 12± (page 211) shows three different cases:  
• ODT C: Asynchronous behavior before tANPD.  
• ODT B: ODT state changes during the transition period, with tAOFPD (MIN) < ODTL-  
off × tCK + tAOF (MIN), and ODTLoff × tCK + tAOF (MAX) > tAOFPD (MAX).  
• ODT A: ODT state changes after the transition period with synchronous response.  
PDF: 09005aef826aa906  
1Gb_DDR3_SDRAM.pdf - Rev. L 03/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
210  
‹ 2006 Micron Technology, Inc. All rights reserved.  
 复制成功!