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MT18VDDT12872AG 参数 Datasheet PDF下载

MT18VDDT12872AG图片预览
型号: MT18VDDT12872AG
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR SDRAM UNBUFFERED DIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 29 页 / 679 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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256MB, 512MB, 1GB (x72, ECC, DR), PC3200  
184-PIN DDR SDRAM UDIMM  
Bu rst Le n g t h  
Fig u re 4: Mo d e Re g ist e r De fin it io n  
Read and write accesses to the DDR SDRAM are  
burst oriented, with the burst length being program-  
mable, as shown in Figure 4, Mode Register Definition  
Diagram . The burst length determ ines the m aximum  
number of column locations that can be accessed for a  
given READ or WRITE command. Burst lengths of 2, 4,  
or 8 locations are available for both the sequential and  
the interleaved burst types.  
Dia g ra m  
256MB Module  
BA1  
A8  
A9  
A6 A5 A4  
A1  
A0  
Address Bus  
BA0  
A10  
A7  
A3 A2  
A11  
13 12 11 10  
9
8
7
6
5
4
3
2
1
0
Mode Register (Mx)  
0* 0*  
Operating Mode  
CAS Latency BT Burst Length  
* M13 and M12 (BA1and BA0)  
must be “0, 0” to select the  
base mode register (vs. the  
extended mode register).  
Reserved states should not be used, as unknown  
operation or incompatibility with future versions may  
result.  
When a READ or WRITE command is issued, a block  
of columns equal to the burst length is effectively  
selected. All accesses for that burst take place within  
this block, m eaning that the burst will wrap within the  
block if a boundary is reached. The block is uniquely  
selected by A1Ai when the burst length is set to two,  
by A2Ai when the burst length is set to four and by  
A3Ai when the burst length is set to eight (where Ai is  
the most significant column address bit for a given  
configuration; see Note 5 of Table 6, Burst Definition  
Table, on page 9). The remaining (least significant)  
address bit(s) is (are) used to select the starting loca-  
tion within the block. The programmed burst length  
applies to both READ and WRITE bursts.  
512MB, 1GB Modules  
BA1  
A8  
A9  
A6 A5 A4  
A1  
A0  
Address Bus  
BA0  
A10  
A7  
A3 A2  
A12 A11  
14 13 12 11 10  
9
8
7
6
5
4
3
2
1
0
Mode Register (Mx)  
0* 0*  
Operating Mode  
CAS Latency BT Burst Length  
* M14 and M13 (BA1 and BA0)  
must be “0, 0” to select the  
base mode register (vs. the  
extended mode register).  
Burst Length  
M2 M1 M0  
M3 = 0  
Reserved  
2
M3 = 1  
Reserved  
2
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
4
4
8
8
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Bu rst Typ e  
Accesses within a given burst may be programmed  
to be either sequential or interleaved; this is referred to  
as the burst type and is selected via bit M3.  
The ordering of accesses within a burst is deter-  
m ined by the burst length, the burst type and the start-  
ing column address, as shown in Table 6, Burst  
Definition Table, on page 9.  
Burst Type  
Sequential  
Interleaved  
M3  
0
1
CAS Latency  
Reserved  
Reserved  
2
M6 M5 M4  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
Re a d La t e n cy  
3
The READ latency is the delay, in clock cycles,  
between the registration of a READ com m and and the  
availability of the first bit of output data. The latency  
can be set to 3, 2.5, or 2 clocks, as shown in Figure 5,  
CAS Latency Diagram, on page 9.  
Reserved  
Reserved  
2.5  
Reserved  
If a READ com m and is registered at clock edge n,  
and the latency is m clocks, the data will be available  
nominally coincident with clock edge n + m. Table 7,  
CAS Latency (CL) Table, on page 9, indicates the oper-  
ating frequencies at which each CAS latency setting  
can be used.  
M12 M11 M10 M9 M8 M7  
M6-M0  
Valid  
Valid  
-
Operating Mode  
Normal Operation  
0
0
-
0
0
-
0
0
-
0
0
-
0
1
-
0
0
-
Normal Operation/Reset DLL  
All other states reserved  
Reserved states should not be used as unknown  
operation or incompatibility with future versions may  
result.  
pdf: 09005aef80814e61, source: 09005aef80a43eed  
DDA18C32_64_128x72AG.fm - Rev. E 9/04 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2004 Micron Technology, Inc.  
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