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MT18VDDF12872H 参数 Datasheet PDF下载

MT18VDDF12872H图片预览
型号: MT18VDDF12872H
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR SDRAM SODIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 10 页 / 217 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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1GB (x72, ECC, DR) 200-Pin DDR SDRAM SODIMM  
DD Specifications  
I
IDD Specifications  
Table 8:  
IDD Specifications and Conditions – 1GB  
Values are shown for the MT46V64M8 DDR SDRAM only and are computed from values specified in the  
512Mb (64 Meg x 8) component data sheet  
-26A/  
-265  
Parameter/Condition  
Symbol  
-40B  
-335  
Units  
IDD01  
1,440  
1,215  
1,080  
mA  
Operating one bank active-precharge current: One device  
bank; Active-precharge; tRC = tRC (MIN); tCK = tCK (MIN); DQ,  
DM, and DQS inputs changing once per clock cycle; Address  
and control inputs changing once every two clock cycles  
IDD11  
1,710  
1,485  
1,350  
mA  
Operating one bank active-read-precharge current: One  
device bank; Active-read precharge; BL = 4; tRC = tRC (MIN);  
tCK = tCK (MIN); IOUT = 0mA; Address and control inputs  
changing once per clock cycle  
IDD2P2  
IDD2F2  
90  
90  
90  
mA  
mA  
Precharge power-down standby current: All device banks  
idle; Power-down mode; tCK = tCK (MIN); CKE = (LOW)  
990  
810  
720  
Idle standby current: CS# = HIGH; All device banks idle;  
tCK = tCK (MIN); CKE = HIGH; Address and other control  
inputs changing once per clock cycle; VIN = VREF for DQ, DQS,  
and DM  
IDD3P2  
IDD3N2  
810  
630  
900  
540  
810  
mA  
mA  
Active power-down standby current: One device bank  
active; Power-down mode; tCK = tCK (MIN); CKE = LOW  
1,080  
Active standby current: CS# = HIGH; CKE = HIGH; One  
device bank; Active-precharge; tRC = tRAS (MAX);  
tCK = tCK (MIN); DQ, DM, and DQS inputs changing twice per  
clock cycle; Address and other control inputs changing once  
per clock cycle  
IDD4R1  
1,755  
1,800  
1,530  
1,320  
1,350  
1,260  
mA  
mA  
Operating burst read current: BL = 2; Continuous burst  
reads; One device bank active; Address and control inputs  
changing once per clock cycle; tCK = tCK (MIN); IOUT = 0mA  
IDD4W1  
Operating burst write current: BL = 2; Continuous burst  
writes; One device bank active; Address and control inputs  
changing once per clock cycle; tCK = tCK (MIN); DQ, DM, and  
DQS inputs changing twice per clock cycle  
IDD52  
IDD5A2  
IDD62  
6,210  
198  
5,220  
180  
5,040  
180  
mA  
mA  
mA  
mA  
Auto refresh current  
tREFC = tRFC (MIN)  
tREFC = 7.8125µs  
90  
90  
90  
Self refresh current: CKE 0.2V  
IDD71  
4,095  
3,690  
3,195  
Operating bank interleave read current: Four device bank  
interleaving reads; (BL = 4) with auto precharge;  
tRC = tRC (MIN); tCK = tCK (MIN); Address and control inputs  
change only during active READ or WRITE commands  
Notes: 1. Value calculated as one module rank in this operating condition; all other module ranks are  
in IDD2P (CKE LOW) mode.  
2. Value calculated reflects all module ranks in this operating condition.  
PDF: 09005aef80e4880c/Source: 09005aef80e487d7  
DDF18C128x72H.fm - Rev. B 10/07 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2004 Micron Technology, Inc. All rights reserved.  
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