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MT16VDDF6464HY-335 参数 Datasheet PDF下载

MT16VDDF6464HY-335图片预览
型号: MT16VDDF6464HY-335
PDF下载: 下载PDF文件 查看货源
内容描述: 小外形的DDR SDRAM DIMM [SMALL-OUTLINE DDR SDRAM DIMM]
分类和应用: 内存集成电路光电二极管动态存储器双倍数据速率时钟
文件页数/大小: 31 页 / 552 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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512MB, 1GB (x64)  
200-PIN DDR SODIMM  
Table 12: IDD Specifications and Conditions – 512MB  
Notes: 1–5, 8, 10, 12, 48; DDR SDRAM devices only; notes appear on pages 20–23; 0°Cꢀ? TA ? +70°C; VDD, VDDQ = +2.5V 0.2V  
MAX  
-26A/-  
265  
UNIT NOTE  
PARAMETER/CONDITION  
SYM  
-335  
-262  
-202  
S
S
a
IDD0  
1,032  
1,032  
872  
992  
mA 20, 42  
OPERATING CURRENT: One device bank; Active-  
Precharge; tRC = tRC (MIN); tCK = tCK (MIN); DQ, DM and  
DQS inputs changing once per clock cycle; Address and  
control inputs changing once every two clock cycles  
a
IDD1  
1,392  
1,312  
1,192  
1,272  
mA 20, 42  
OPERATING CURRENT: One device bank; Active-Read-  
Precharge; Burst = 4; tRC = tRC (MIN); tCK = tCK (MIN);  
IOUT = 0mA; Address and control inputs changing once  
per clock cycle  
b
IDD2P  
IDD2F  
64  
64  
64  
64  
mA 21, 28,  
44  
PRECHARGE POWER-DOWN STANDBY CURRENT: All  
device banks idle; Power-down mode; tCK = tCK (MIN);  
CKE = (LOW)  
b
800  
720  
720  
720  
mA  
45  
IDLE STANDBY CURRENT: CS# = HIGH; All device banks  
are idle; tCK = tCK (MIN); CKE = HIGH; Address and other  
control inputs changing once per clock cycle. VIN = VREF  
for DQ, DQS, and DM  
b
b
IDD3P  
480  
960  
400  
800  
400  
800  
480  
800  
mA 21, 28,  
44  
ACTIVE POWER-DOWN STANDBY CURRENT: One device  
bank active; Power-down mode; tCK = tCK (MIN);  
CKE = LOW  
IDD3N  
mA  
41  
ACTIVE STANDBY CURRENT: CS# = HIGH; CKE = HIGH;  
One device bank active; tRC = tRAS (MAX); tCK = tCK  
(MIN); DQ, DM and DQS inputs changing twice per clock  
cycle; Address and other control inputs changing once per  
clock cycle  
a
IDD4R  
1,432  
1,272  
1,232  
1,112  
1,232  
1,122  
1,432  
1,552  
mA 20, 42  
OPERATING CURRENT: Burst = 2; Reads; Continuous  
burst; One device bank active; Address and control inputs  
changing once per clock cycle; tCK = tCK (MIN); IOUT =  
0mA  
a
IDD4W  
mA  
20  
OPERATING CURRENT: Burst = 2; Writes; Continuous  
burst; One device bank active; Address and control  
inputs changing once per clock cycle; tCK = tCK (MIN); DQ,  
DM, and DQS inputs changing twice per clock cycle  
b
tRC = tRFC  
IDD5  
4,080  
96  
3,760  
96  
3,760  
96  
3,920  
96  
mA 20, 44  
mA 24, 44  
AUTO REFRESH BURST CURRENT:  
(MIN) tRFC =  
7.8125µs  
IDD5A  
b
b
SELF REFRESH CURRENT: CKE ? 0.2V  
IDD6  
IDD7  
64  
64  
64  
64  
mA  
9
a
3,272  
2,832  
2,832  
2,952  
mA 20, 43  
OPERATING CURRENT: Four device bank interleaving  
READs (Burst = 4) with auto precharge, tRC = minimum  
tRC allowed; tCK = tCK (MIN); Address and control inputs  
change only during Active READ, or WRITE commands  
NOTE:  
a - Value calculated as one module rank in this operating condition, and all other module ranks in IDD2p (CKE LOW) mode.  
b - Value calculated reflects all module ranks in this operating condition.  
09005aef80a646bc  
DDF16C64_128x64HG_B.fm - Rev. B 7/03 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology, Inc.  
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