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MT16VDDF12864HG-265 参数 Datasheet PDF下载

MT16VDDF12864HG-265图片预览
型号: MT16VDDF12864HG-265
PDF下载: 下载PDF文件 查看货源
内容描述: 小外形的DDR SDRAM DIMM [SMALL-OUTLINE DDR SDRAM DIMM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 31 页 / 552 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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512MB, 1GB (x64)  
200-PIN DDR SODIMM  
Table 21: Serial Presence-Detect Matrix (Continued)  
“1”/“0”: Serial Data, “driven to HIGH”/“driven to LOW”; notes appear on page 29  
BYTE  
DESCRIPTION  
ENTRY (VERSION)  
MT16VDDF6464H MT16VDDF12864H  
Minimum RAS# Pulse Width, (tRAS)  
(See note 2)  
30  
42ns (-335)  
45ns (-262/-26A/-265)  
40ns (-202)  
2A  
2D  
28  
2A  
2D  
28  
31  
32  
256MB, 512MB  
40  
80  
Module Rank Density  
Address and Command Setup Time, (tIS)  
(See note 3)  
0.8ns (-335)  
1ns (-262/-26A/-265)  
1.1ns (-202)  
80  
A0  
B0  
80  
A0  
B0  
Address and Command Hold Time, (tIH)  
(See note 3)  
33  
34  
35  
0.8ns (-335)  
1ns (-262/-26A/-265)  
1.1ns (-202)  
80  
A0  
B0  
80  
A0  
B0  
Data/ Data Mask Input Setup Time, (tDS)  
0.45ns (-335)  
0.5ns (-262/-26A/-265)  
0.6ns (-202)  
45  
50  
60  
45  
50  
60  
Data/ Data Mask Input Hold Time, (tDH)  
0.45ns (-335)  
0.5ns (-262/-26A/-265)  
0.6ns (-202)  
45  
50  
60  
45  
50  
60  
36-40 Reserved  
41  
00  
00  
Minimum Active Auto Refresh Time (tRC)  
60ns (-335/-262)  
65ns (-26A/-265)  
70ns (-202)  
3C  
41  
46  
3C  
41  
46  
42  
72ns (-335)  
75ns (-262/-26A/-265)  
80ns (-202)  
48  
4B  
50  
48  
4B  
50  
Minimum Auto Refresh to Active/Auto Refresh  
Command Period, (tRFC)  
SDRAM Device Max Cycle Time (tCKMAX)  
43  
44  
12ns (-335)  
13ns (-262/-26A/-265/-202)  
30  
34  
30  
34  
0.40ns (-335)  
0.5ns (-262/-26A/-265)  
0.6ns (-202)  
28  
32  
3C  
28  
32  
3C  
SDRAM Device Max DQS-DQ Skew Time  
(tDQSQ)  
45  
SDRAM Device Max Read Data Hold Skew  
Factor (tQHS)  
0.5ns (-335)  
0.75ns (-26A/-265)  
1.0ns (-202)  
50  
75  
A0  
50  
75  
A0  
46  
47  
00  
01  
00  
10  
00  
01  
00  
10  
Reserved  
DIMM Height  
Reserved  
48–61  
62  
Release 1.0  
SPD Revision  
Checksum for Bytes 0-62  
63  
-335  
-262  
-26A  
-265  
-202  
30  
BB  
E8  
18  
B3  
5F  
FC  
29  
59  
F4  
64  
65-71  
72  
MICRON  
2C  
00  
2C  
00  
Manufacturer’s JEDEC ID Code  
Manufacturer’s JEDEC ID Code (Continued)  
Manufacturing Location  
01–12  
01–0C  
01–0D  
73-90  
91  
Variable Data  
01-09  
Variable Data  
01-09  
Module Part Number (ASCII)  
PCB Identification Code  
1-9  
0
92  
00  
00  
Identification Code (Continued)  
Year of Manufacture in BCD  
93  
Variable Data  
Variable Data  
09005aef80a646bc  
DDF16C64_128x64HG_B.fm - Rev. B 7/03 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology, Inc.  
28  
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