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MT16LSDF6464LHY-13E 参数 Datasheet PDF下载

MT16LSDF6464LHY-13E图片预览
型号: MT16LSDF6464LHY-13E
PDF下载: 下载PDF文件 查看货源
内容描述: [SMALL-OUTLINE SDRAM MODULE]
分类和应用: 时钟动态存储器光电二极管内存集成电路
文件页数/大小: 22 页 / 476 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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256MB, 512MB (x64, DR)  
144-PIN SDRAM SODIMM  
Absolute Maximum Ratings  
Stresses greater than those listed may cause perma-  
nent damage to the device. This is a stress rating only,  
and functional operation of the device at these or any  
other conditions above those indicated in the opera-  
tional sections of this specification is not implied.  
Exposure to absolute maximum rating conditions for  
extended periods may affect reliability.  
Voltage on VDD Supply,  
Operating Temperature,  
Relative to VSS . . . . . . . . . . . . . . . . . . . . -1V to +4.6V  
Voltage on Inputs, NC or I/O Pins  
T
(Commercial - ambient) . . . . . .0°C to +65°C  
OPR  
Storage Temperature (plastic) . . . . . .-55°C to +125°C  
Short Circuit Output Current. . . . . . . . . . . . . . . . 50mA  
Relative to VSS . . . . . . . . . . . . . . . . . . . -1V to +4.6V  
Table 10: DC Electrical Characteristics and Operating Conditions  
Notes: 1, 5, 6; notes appear on page 16; VDD, VDDQ = +3.3V 0.3V  
PARAMETER/CONDITION  
SYMBOL  
MIN  
MAX  
UNITS NOTES  
VDD, VDDQ  
3
2
3.6  
VDD + 0.3  
0.8  
V
Supply voltage  
VIH  
VIL  
II  
V
V
22  
22  
33  
Input high voltage: Logic 1; All inputs  
Input low voltage: Logic 0; All inputs  
–0.3  
µA  
Input leakage current:  
Any input 0V VIN VDD  
(All other pins not under test = 0V)  
Command and  
Address Inputs  
–80  
–40  
–10  
–10  
80  
40  
10  
10  
CK, CKE, S#  
DQMB  
IOZ  
µA  
33  
Output leakage current: DQ pins are disabled; DQ  
0V VOUT VDDQ  
VOH  
VOL  
2.4  
V
V
Output levels:  
Output High Voltage (IOUT = -4mA)  
Output Low Voltage (IOUT = 4mA)  
0.4  
Table 11: IDD Specifications and Conditions – 256MB  
Notes: 1, 5, 6, 11, 13; SDRAM components only; notes appear on page 16; VDD, VDDQ = +3.3V 0.3V  
MAX  
PARAMETER/CONDITION  
SYMBOL  
-13E -133 -10E UNITS  
NOTES  
IDD1a  
1,296 1,216 1,136  
mA  
3, 17, 19, 32  
Operating current: Active mode; Burst = 2; READ or WRITE;  
tRC = tRC (MIN)  
IDD2b  
IDD3a  
32  
32  
32  
mA  
mA  
32  
Standby current: Power-down mode; All device banks idle;  
CKE = LOW  
416  
416  
336  
3, 12, 19, 32  
Standby current: Active mode;  
CKE = HIGH; CS# = HIGH; All device banks active after tRCD  
met; No accesses in progress  
IDD4a  
1,336 1,216 1,136  
5,280 4,960 4,320  
mA  
3, 18, 19, 32  
Operating current: Burst mode; Continuous burst; READ or  
WRITE; All device banks active  
IDD5b  
IDD6b  
IDD7b  
IDD7b  
tRFC = tRFC (MIN)  
tRFC = 15.625µs  
mA  
mA  
mA  
mA  
3, 12, 18, 19,  
32,30  
Auto refresh current  
CKE = HIGH; S# = HIGH  
48  
32  
16  
48  
32  
16  
48  
32  
16  
4
Self refresh current: CKE 0.2V  
Standard  
Low power (L)  
a - Value calculated as one module rank in this operating condition, and all other ranks in power-down mode.  
b - Value calculated reflects all module ranks in this operation condition.  
pdf: 09005aef807924d2, source: 09005aef807924f1  
SDF16C32_64x64HG.fm - Rev. E 4/06 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2006 Micron Technology, Inc. All rights reserved.  
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