256Mb: 3V Embedded Parallel NOR Flash
Features
Part Numbering Information
Available with extended memory block prelocked by Micron. Devices are shipped from the factory with memory
content bits erased to 1. For available options, such as packages or high/low protection, or for further information,
contact your Micron sales representative. Part numbers can be verified at www.micron.com. Feature and specifica-
tion comparison by device type is available at www.micron.com/products. Contact the factory for devices not
found.
Table 1: Part Number Information
Part Number
Category
Category Details
Notes
Device Type
M29
Architecture
Operating Voltage
Device function
Speed
D = Dual operation
W = VCC = 2.7 to 3.6V
256G = 256Mb (x16) page, dual boot
70 = 70ns
1, 2
1, 2
7A = 70ns
Package
NF = 56-pin TSOP, 14mm x 20mm, lead-free, halogen-free, RoHS-compliant
ZA = 64-pin TBGA, 10mm x 13mm, lead-free, halogen-free, RoHS-compliant
ZS = 64-pin Fortified BGA, 11mm x 13mm, lead-free, halogen-free, RoHS-compliant
Temperature Range 1 = 0 to 70°C
6 = –40°C to +85°C
Shipping Options
E = RoHS-compliant package, standard packing
F = RoHS-compliant package, tape and reel packing
1. 80ns if VCCQ = 1.65V to VCC.
Notes:
2. Automotive certified –40°C to +85°C, available only with option 6.
PDF: 09005aef84ecabef
m29dw_256g.pdf - Rev. A 10/12 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2
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