M25P40 Serial Flash Embedded Memory
Revision History
Revision History
Rev. G – 05/13
• Reset Revision History to begin with Micron rebrand.
• Removed all lithography information except for 110nm.
Rev. F – 01/13
• Removed part numbers from page 1.
• Updated READ Identification in the Command Set Codes table to include 9Eh infor-
mation.
• Updated SO8W 208 mils Body Width drawing.
• Deleted DFN8 6mm x 5mm drawing.
• Updated Device Ordering Information section.
Rev. E – 08/12
Rev. D – 04/12
• Updated Command Set to include RELEASE FROM DEEP POWER-DOWN.
• Updated Memory Map to eliminate the 64KB block box.
• Updated dimensions for MB package in the Part Number Information Scheme table
in Device Ordering Information.
• In Signal Names table, changed direction column for DQ0 and DQ1 to input and out-
put respectively.
• Changed the Write Disable Command Sequenced graphic.
• Revised Write Status Register topic.
• Revised Power-Up/Down and Supply Line Decoupling topic.
• Revised DFN8 6mm x 5mm package figure.
Rev. C – 03/12
• Updated dimensions for MC package in the Part Number Information Scheme table
in Device Ordering Information.
Rev. B – 02/12
• Corrected error in SO8N package drawing.
• Applied Micron branding.
Rev. A – 09/2011
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www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
PDF: 09005aef8456654f
m25p40.pdf - Rev. G 05/13 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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© 2011 Micron Technology, Inc. All rights reserved.
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