Micron M25P40 Serial Flash Embedded Memory
Maximum Ratings and Operating Conditions
Maximum Ratings and Operating Conditions
Caution: Stressing the device beyond the absolute maximum ratings may cause perma-
nent damage to the device. These are stress ratings only and operation of the device be-
yond any specification or condition in the operating sections of this data sheet is not
recommended. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Table 9: Absolute Maximum Ratings
Symbol
TSTG
Parameter
Min
–65
—
Max
150
Units
°C
Notes
Storage temperature
Lead temperature during soldering
TLEAD
VIO
See note
VCC+0.6
°C
1
2
Input and output voltage (with respect to
ground)
–0.6
V
VCC
Supply voltage
–0.6
4.0
V
V
VESD
Electrostatic discharge voltage (human body
model)
–2000
2000
3
1. The TLEAD signal is compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb as-
sembly), the Micron RoHS-compliant 7191395 specification, and the European directive
on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
Notes:
2. The minimum voltage may reach the value of –2V for no more than 20ns during transi-
tions; the maximum may reach the value of VCC +2V for no more than 20ns during tran-
sitions.
3. The VESD signal: JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
Table 10: Operating Conditions
Symbol
VCC
Parameter
Min
2.3
Max
3.6
Unit
V
Supply voltage
TA
Ambient operating temperature (grade 6)
Ambient operating temperature (grade 3)
–40
–40
85
°C
TA
125
°C
Table 11: Data Retention and Endurance
Parameter
Program/erase cycles Grade 6, Grade 3
Data retention at 55°C
Condition
Min
100,000
20
Max
Unit
–
–
Cycles per unit
Years
PDF: 09005aef8456654f
m25p40.pdf - Rev. Y 8/12 EN
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