512Mb, 1Gb, 2Gb: P30-65nm
Signal Descriptions
Signal Descriptions
Table 4: TSOP and Easy BGA Signal Descriptions
Symbol
Type
Name and Function
A[MAX:1]
Input
Address inputs: Device address inputs.
Note: Unused active address pins should not be left floating; tie them to VCCQ or VSS ac-
cording to specific design requirements.
ADV#
CE#
Input
Input
Input
Address valid: Active LOW input. During synchronous READ operations, addresses are
latched on the rising edge of ADV#, or on the next valid CLK edge with ADV# LOW, which-
ever occurs first. In asynchronous mode, the address is latched when ADV# goes HIGH or
continuously flows through if ADV# is held LOW.
Note: Designs not using ADV# must tie it to VSS to allow addresses to flow through.
Chip enable: Active LOW input. CE# LOW selects the associated die. When asserted, inter-
nal control logic, input buffers, decoders, and sense amplifiers are active. When de-asser-
ted, the associated die is deselected, power is reduced to standby levels, data and wait
outputs are placed in High-Z.
Note: CE# must be driven HIGH when device is not in use.
CLK
Clock: Synchronizes the device with the system bus frequency in synchronous-read mode.
During synchronous READs, addresses are latched on the rising edge of ADV#, or on the
next valid CLK edge with ADV# LOW, whichever occurs first.
Note: Designs not using CLK for synchronous read mode must tie it to VCCQ or VSS.
OE#
Input
Input
Output enable: Active LOW input. OE# LOW enables the device’s output data buffers
during READ cycles. OE# HIGH places the data outputs and WAIT in High-Z.
RST#
Reset: Active LOW input. RST# resets internal automation and inhibits WRITE operations.
This provides data protection during power transitions. RST# HIGH enables normal opera-
tion. Exit from reset places the device in asynchronous read array mode.
WP#
Input
Write protect: Active LOW input. WP# LOW enables the lock-down mechanism. Blocks in
lock-down cannot be unlocked with the Unlock command. WP# HIGH overrides the lock-
down function enabling blocks to be erased or programmed using software commands.
Note: Designs not using WP# for protection could tie it to VCCQ or VSS without additional
capacitor.
WE#
VPP
Input
Write enable: Active LOW input. WE# controls writes to the device. Address and data are
latched on the rising edge of WE# or CE#, whichever occurs first.
Power/Input Erase and program power: A valid voltage on this pin allows erasing or programming.
Memory contents cannot be altered when VPP ≤ VPPLK. Block erase and program at invalid
VPP voltages should not be attempted.
Set VPP = VPPL for in-system PROGRAM and ERASE operations. To accommodate resistor or
diode drops from the system supply, the VIH level of VPP can be as low as VPPL,min . VPP must
remain above VPPL,min to perform in-system modification. VPP may be 0V during READ op-
erations.
VPP can be connected to 9V for a cumulative total not to exceed 80 hours. Extended use of
this pin at 9V may reduce block cycling capability.
DQ[15:0]
Input/Output Data input/output: Inputs data and commands during WRITE cycles; outputs data during
memory, status register, protection register, and read configuration register reads. Data
balls float when the CE# or OE# are de-asserted. Data is internally latched during writes.
PDF: 09005aef845667b3
p30_65nm_MLC_512Mb-1gb_2gb.pdf - Rev. B 12/13 EN
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