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JS28F256P30TFE 参数 Datasheet PDF下载

JS28F256P30TFE图片预览
型号: JS28F256P30TFE
PDF下载: 下载PDF文件 查看货源
内容描述: 256MB和512MB (256 / 256MB ) , P30-65nm [256Mb and 512Mb (256Mb/256Mb), P30-65nm]
分类和应用:
文件页数/大小: 95 页 / 1351 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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256Mb and 512Mb (256Mb/256Mb), P30-65nm  
Introduction  
Introduction  
This document provides information about the Micron Flash memory (P30-65nm)  
product and describes its features, operations, and specifications.  
The Micron Flash memory (P30-65nm) is the latest generation of flash memory devices.  
P30-65nm device will be offered in 64Mb up through 2Gb densities. This document cov-  
ers specifically 256Mb and 512Mb (256Mb/256Mb) product information. Benefits in-  
clude more density in less space, high-speed interface device, and support for code and  
data storage. Features include high-performance synchronous-burst read mode, fast  
asynchronous access times, low power, flexible security options, and three industry-  
standard package choices. The P30-65nm product family is manufactured using Micron  
65nm process technology.  
Overview  
This section provides an overview of the features and capabilities of the P30-65nm.  
The P30-65nm family devices provides high performance at low voltage on a 16-bit data  
bus. Individually erasable memory blocks are sized for optimum code and data storage.  
Upon initial power up or return from reset, the device defaults to asynchronous page-  
mode read. Configuring the Read Configuration Register enables synchronous burst-  
mode reads. In synchronous burst mode, output data is synchronized with a user-sup-  
plied clock signal. A WAIT signal provides easy CPU-to-flash memory synchronization.  
In addition to the enhanced architecture and interface, the device incorporates technol-  
ogy that enables fast factory program and erase operations. Designed for low-voltage  
systems, the P30-65nm supports read operations with VCC at 1.8 V, and erase and pro-  
gram operations with VPP at 1.8 V or 9.0 V. Buffered Enhanced Factory Programming  
(BEFP) provides the fastest flash array programming performance with VPP at 9.0 V,  
which increases factory throughput. With VPP at 1.8 V, VCC and VPP can be tied together  
for a simple, ultra low power design. In addition to voltage flexibility, a dedicated VPP  
connection provides complete data protection when VPP VPPLK  
.
A Command User Interface (CUI) is the interface between the system processor and all  
internal operations of the device. An internal Write State Machine (WSM) automatically  
executes the algorithms and timings necessary for block erase and program. A Status  
Register indicates erase or program completion and any errors that may have occurred.  
An industry-standard command sequence invokes program and erase automation.  
Each erase operation erases one block. The Erase Suspend feature allows system soft-  
ware to pause an erase cycle to read or program data in another block. Program Sus-  
pend allows system software to pause programming to read other locations. Data is pro-  
grammed in word increments (16 bits).  
The P30-65nm protection register allows unique flash device identification that can be  
used to increase system security. The individual Block Lock feature provides zero-laten-  
cy block locking and unlocking. The P30-65nm device includes enhanced protection via  
Password Access; this new feature allows write and/or read access protection of user-  
defined blocks. In addition, the P30-65nm device also provides the full-device One-  
Time Programmable (OTP) security feature.  
PDF: 09005aef84566799  
p30_65nm_256Mb-512mb.pdf - Rev. A 1/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
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© 2013 Micron Technology, Inc. All rights reserved.  
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