TCN75A
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
2
b
1
e
c
ϕ
A2
A
L1
L
A1
Units
MILLIMETERS
Dimension Limits
NOM
8
MAX
MIN
Number of Pins
Pitch
N
e
0.65 BSC
—
—
Overall Height
A
1.10
0.95
0.15
0.75
0.00
0.85
Molded Package Thickness
Standoff
A2
A1
E
—
4.90 BSC
3.00 BSC
3.00 BSC
0.60
Overall Width
Molded Package Width
Overall Length
Foot Length
E1
D
0.40
L
0.80
0.95 REF
—
Footprint
L1
0°
Foot Angle
ϕ
8°
0.08
0.22
—
Lead Thickness
Lead Width
c
0.23
0.40
—
b
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
© 2006 Microchip Technology Inc.
DS21935C-page 25
MICROCHIP [ MICROCHIP ]
