3A DUAL HIGH-SPEED POWER MOSFET DRIVERS
TC4423
TC4424
TC4425
TC4423 Crossover Energy
Thermal Derating Curves
–8
10
1400
8
8 Pin DIP
6
1200
4
16 Pin SOIC
1000
800
2
–9
8
6
10
8 Pin CerDIP
600
400
200
0
4
2
–10
10
0
2
4
6
8
10 12 14 16 18
0
20
40
60
80
120 140
100
V
IN
AMBIENT TEMPERATURE (°C)
NOTE: The values on this graph represent the loss
seen by both drivers in a package during one
complete cycle. For a single driver, divide the stated
values by 2. For a single transition of a single driver,
divide the stated value by 4.
*Static-sensitive device. Unused devices must be stored in conductive
material. Protect devices from static discharge and static fields. Stresses
above those listed under Absolute Maximum Ratings (See page 2) may
cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions above
those indicated in the operational sections of the specifications is not
implied. Exposure to Absolute Maximum Rating Conditions for extended
periods may affect device reliability.
PACKAGE DIMENSIONS
8-Pin Plastic DIP
PIN 1
.260 (6.60)
.240 (6.10)
.045 (1.14)
.030 (0.76)
.070 (1.78)
.040 (1.02)
.310 (7.87)
.290 (7.37)
.400 (10.16)
.348 (8.84)
.200 (5.08)
.140 (3.56)
.040 (1.02)
.020 (0.51)
.015 (0.38)
.008 (0.20)
3° MIN.
.150 (3.81)
.115 (2.92)
.400 (10.16)
.310 (7.87)
.110 (2.79)
.090 (2.29)
.022 (0.56)
.015 (0.38)
Dimensions: inches (mm)
© 2001 Microchip Technology Inc. DS21421A
TC4423/4/5-6 10/21/96
7
MICROCHIP [ MICROCHIP ]
