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TC1185-1.8VCT713 参数 Datasheet PDF下载

TC1185-1.8VCT713图片预览
型号: TC1185-1.8VCT713
PDF下载: 下载PDF文件 查看货源
内容描述: 50毫安100 mA和150毫安CMOS LDO,具有关断和参考旁路 [50 mA, 100 mA and 150 mA CMOS LDOs with Shutdown and Reference Bypass]
分类和应用:
文件页数/大小: 22 页 / 690 K
品牌: MICROCHIP [ MICROCHIP ]
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TC1014/TC1015/TC1185  
Equation 5-1 can be used in conjunction with  
Equation 5-2 to ensure regulator thermal operation is  
within limits. For example:  
5.0  
5.1  
THERMAL CONSIDERATIONS  
Thermal Shutdown  
Given:  
Integrated thermal protection circuitry shuts the  
regulator off when die temperature exceeds 160°C.  
The regulator remains off until the die temperature  
drops to approximately 150°C.  
VINMAX  
VOUTMIN  
ILOADMAX  
TJMAX  
=
=
=
=
=
3.0V +10%  
2.7V – 2.5%  
40 mA  
125°C  
5.2  
Power Dissipation  
TAMAX  
55°C  
The amount of power the regulator dissipates is  
primarily a function of input and output voltage, and  
output current. The following equation is used to  
calculate worst-case actual power dissipation:  
Find:  
1. Actual power dissipation  
2. Maximum allowable dissipation  
Actual power dissipation:  
EQUATION 5-1:  
PD (VINMAX – VOUTMIN)ILOADMAX  
= [(3.0 x 1.1) – (2.7 x .975)]40 x 10–3  
= 26.7 mW  
PD ≈ (VINMAX VOUTMIN)ILOADMAX  
Where:  
PD = Worst-case actual power  
dissipation  
Maximum allowable power dissipation:  
(TJMAX TAMAX  
PDMAX = -------------------------------------------  
θJA  
)
VINMAX = Maximum voltage on VIN  
VOUTMIN = Minimum regulator output voltage  
ILOADMAX = Maximum output (load) current  
(125 55)  
= -------------------------  
220  
= 318 mW  
The  
maximum  
allowable  
power  
dissipation  
(Equation 5-2) is a function of the maximum ambient  
temperature (TAMAX), the maximum allowable die  
temperature (TJMAX) and the thermal resistance from  
junction-to-air (θJA). The 5-pin SOT-23 package has a  
In this example, the TC1014 dissipates a maximum of  
26.7 mW below the allowable limit of 318 mW. In a  
similar manner, Equation 5-1 and Equation 5-2 can be  
used to calculate maximum current and/or input  
voltage limits.  
θJA of approximately 220°C/Watt.  
EQUATION 5-2:  
5.3  
Layout Considerations  
(TJMAX TAMAX  
)
The primary path of heat conduction out of the package  
is via the package leads. Therefore, layouts having a  
ground plane, wide traces at the pads, and wide power  
supply bus lines combine to lower θJA and therefore  
increase the maximum allowable power dissipation  
limit.  
PDMAX = -------------------------------------------  
θJA  
Where all terms are previously defined.  
© 2007 Microchip Technology Inc.  
DS21335E-page 13