PIC18F2420/2520/4420/4520
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2420/2520/4420/4520 (Industrial)
PIC18LF2420/2520/4420/4520 (Industrial) (Continued)
PIC18LF2420/2520/4420/4520
Standard Operating Conditions (unless otherwise stated)
(Industrial)
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
Standard Operating Conditions (unless otherwise stated)
PIC18F2420/2520/4420/4520
Operating temperature
-40°C ≤ TA ≤ +85°C for industrial
-40°C ≤ TA ≤ +125°C for extended
(Industrial, Extended)
Param
Device
No.
Typ
Max Units
Conditions
(2)
Supply Current (IDD)
PIC18LF2X2X/4X20 250
350
350
350
650
640
600
1.5
1.4
1.3
3.0
1.0
1.0
1.0
1.8
1.8
1.8
4.0
4.0
4.0
5.0
13
μA
μA
μA
μA
μA
-40°C
260
+25°C
+85°C
-40°C
VDD = 2.0V
VDD = 3.0V
250
PIC18LF2X2X/4X20 550
FOSC = 1 MHZ
(PRI_RUN,
480
+25°C
+85°C
-40°C
460
μA
EC oscillator)
All devices 1.2
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
1.1
+25°C
+85°C
+125°C
-40°C
VDD = 5.0V
1.0
Extended devices only 1.0
PIC18LF2X2X/4X20 0.72
0.74
+25°C
+85°C
-40°C
VDD = 2.0V
VDD = 3.0V
0.74
PIC18LF2X2X/4X20 1.3
FOSC = 4 MHz
(PRI_RUN,
1.3
+25°C
+85°C
-40°C
1.3
EC oscillator)
All devices 2.7
2.6
+25°C
+85°C
+125°C
+125°C
+125°C
VDD = 5.0V
2.5
Extended devices only 2.6
Extended devices only 8.4
11
VDD = 4.2V
VDD = 5.0V
FOSC = 25 MHz
(PRI_RUN,
EC oscillator)
16
All devices 15
20
20
20
25
25
25
mA
mA
mA
mA
mA
mA
-40°C
+25°C
+85°C
-40°C
+25°C
+85°C
15
VDD = 4.2V
VDD = 5.0V
FOSC = 40 MHZ
(PRI_RUN,
EC oscillator)
15
All devices 20
20
20
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
© 2008 Microchip Technology Inc.
DS39631E-page 329
MICROCHIP [ MICROCHIP ]
