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PIC18F2320-I/SP 参数 Datasheet PDF下载

PIC18F2320-I/SP图片预览
型号: PIC18F2320-I/SP
PDF下载: 下载PDF文件 查看货源
内容描述: 28 /40/ 44引脚高性能,增强型闪存微控制器与10位A / D和纳瓦技术 [28/40/44-Pin High-Performance, Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology]
分类和应用: 闪存微控制器和处理器外围集成电路光电二极管PC时钟
文件页数/大小: 388 页 / 6899 K
品牌: MICROCHIP [ MICROCHIP ]
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PIC18F2220/2320/4220/4320  
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)  
E
E1  
#leads=n1  
p
D1  
D
2
1
B
n
°
CH x 45  
α
A
c
φ
β
A1  
A2  
L
(F)  
Units  
INCHES  
NOM  
MILLIMETERS*  
Dimension Limits  
MIN  
MAX  
MIN  
NOM  
44  
MAX  
n
p
Number of Pins  
Pitch  
44  
.031  
11  
0.80  
11  
Pins per Side  
Overall Height  
n1  
A
.039  
.037  
.002  
.018  
.043  
.039  
.004  
.024  
.039  
3.5  
.047  
1.00  
0.95  
1.10  
1.00  
0.10  
0.60  
1.20  
Molded Package Thickness  
Standoff  
A2  
A1  
L
(F)  
φ
.041  
.006  
.030  
1.05  
0.15  
0.75  
§
0.05  
0.45  
1.00  
0
Foot Length  
Footprint (Reference)  
Foot Angle  
0
.463  
.463  
.390  
.390  
.004  
.012  
.025  
5
7
.482  
.482  
.398  
.398  
.008  
.017  
.045  
15  
3.5  
12.00  
12.00  
10.00  
10.00  
0.15  
0.38  
0.89  
10  
7
12.25  
12.25  
10.10  
10.10  
0.20  
0.44  
1.14  
15  
Overall Width  
E
D
.472  
.472  
.394  
.394  
.006  
.015  
.035  
10  
11.75  
11.75  
9.90  
9.90  
0.09  
0.30  
0.64  
5
Overall Length  
Molded Package Width  
Molded Package Length  
Lead Thickness  
E1  
D1  
c
Lead Width  
B
CH  
α
Pin 1 Corner Chamfer  
Mold Draft Angle Top  
Mold Draft Angle Bottom  
β
5
10  
15  
5
10  
15  
* Controlling Parameter  
§ Significant Characteristic  
Notes:  
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed  
.010” (0.254mm) per side.  
JEDEC Equivalent: MS-026  
Drawing No. C04-076  
DS39599C-page 366  
2003 Microchip Technology Inc.