PIC16F818/819
20-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
E
E1
p
D
B
2
1
n
c
A2
A
f
L
A1
Units
Dimension Limits
INCHES
NOM
20
MILLIMETERS*
MIN
MAX
MIN
NOM
20
MAX
n
p
Number of Pins
Pitch
.026
0.65
-
Overall Height
Molded Package Thickness
Standoff
A
A2
A1
E
-
-
.079
-
2.00
1.85
-
.065
.002
.291
.197
.272
.022
.004
0°
.069
-
.073
-
1.65
0.05
7.40
5.00
.295
0.55
0.09
0°
1.75
-
Overall Width
Molded Package Width
Overall Length
Foot Length
.307
.209
.283
.030
-
.323
.220
.289
.037
.010
8°
7.80
5.30
7.20
0.75
-
8.20
5.60
7.50
0.95
0.25
8°
E1
D
L
c
Lead Thickness
Foot Angle
f
4°
4°
Lead Width
B
.009
-
.015
0.22
-
0.38
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Revised 11/03/03
DS39598E-page 160
2004 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
